Laser sealing of organic light-emitting diode using low melting temperature glass frit

Tailoring the efficient laser‐absorption‐melting behavior of Bi2O3‐B2O3‐ZnO‐Nd2O3 glass for the OLED encapsulation

“…Zhang et al 7 chose the 92.5 wt% bismuthate glass‐7.5 wt% of laser absorbent composite frit to study on laser‐assisted glass frit bonding process by response surface methodology. Lin et al 13 reported that P 2 O 5 ‐V 2 O 3 ‐Fe 2 O 3 demonstrated the advantages of the combination of the new laser‐assisted seal and the low‐temperature PbTiO 3 glass seal with Nd 2 O 3 doped at a specific laser wavelength (802 nm), and successfully used the laser to seal OLED through the low‐temperature glass with Nd 2 O 3 . The disadvantage is that the glass contains lead, which pollutes the environment.…”

“…Recently, there are much of research points on the laserabsorbing-melting bonding of the glass system such as Bi 2 O 3 -B 2 O 3 -based glass, 6,11,12 P 2 O 5 -V 2 O 3 -Fe 2 O 3 glass 13 and BaO-SrO-SiO 2 -B 2 O 3 glass-ceramics 14 and so on. However, it is often overlooked that precise spectral absorption controlling for 800∼810 nm Laser is systematically investigated by sealing glass's composition or structure design.…”