2000
DOI: 10.1016/s0143-8166(00)00061-0
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Laser scribing of polycrystalline thin films

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Cited by 143 publications
(75 citation statements)
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“…(1)] of about 300 nm with D estimated from thermal conductivity, density, and specific heat values. 11,90 Therefore, only the near surface region of the CI(G)Se film is affected by the laser energy, with the film bulk remaining unaltered (see Fig. 3).…”
Section: Pulsed Laser Annealingmentioning
confidence: 99%
See 1 more Smart Citation
“…(1)] of about 300 nm with D estimated from thermal conductivity, density, and specific heat values. 11,90 Therefore, only the near surface region of the CI(G)Se film is affected by the laser energy, with the film bulk remaining unaltered (see Fig. 3).…”
Section: Pulsed Laser Annealingmentioning
confidence: 99%
“…These applications have recently been reviewed in the literature. 7,8 In thin film photovoltaics (PV), lasers have been used for the recrystallization of amorphous Si into polycrystalline Si 9,10 and scribing for the monolithic cell integration of CdTe 11 and CuðIn; GaÞðS; SeÞ 2 (CIGS) 11,12 cells. The aim of this paper is to review laser-based processes for synthesizing and or improving the properties of the chalcogenide absorber layers used in thin film solar cells, namely CdTe and Cu(In, Ga)S(Se).…”
Section: Introductionmentioning
confidence: 99%
“…The layers are numbered in the order in which they are deposited. They are micromachined by laser ablation, an established material removal process that has been extensively studied in literature [8,16]. For this purpose, a short (ns) or ultrashort (ps or fs) pulsed laser beam is focused on the substrate.…”
Section: Laser Scribingmentioning
confidence: 99%
“…The mechanisms responsible for the improvement of soft magnetic properties include magnetic domain refinement, stress relaxation, and inhibition of domain-wall movement [10]. The commercially available laser scribing systems have been optimized typically for other applications and other materials such as scribing of crystalline Si, resistor trimming, or circuit repair [11,12]. In contrast to laser welding [13] or surface alloying by laser melt deposition [14], the laser * corresponding author; e-mail: vpuchy@saske.sk scribing may apply only a very low input power (e.g.…”
Section: Introductionmentioning
confidence: 99%