Laser processing of materials for MCM-C applications

Kita, Jarosław; Gollner, Egmont; Moos, Ralf

doi:10.1109/estc.2008.4684341

Search citation statements

Order By: Relevance

Paper Sections

Select...

Introduction2

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2009

2015

Publication Types

Select...

Article4

Relationship

Self Cite0

Independent4

Authors

Journals

Cited by 4 publications

(2 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In addition, it is shown that the major influence on taper and HAZ is the lamp current and the pulse frequency of the laser. Holes with a diameter as small as 50 m were achieved in only 114 m thin unfired low temperature cofired ceramics (LTCC) by Kita et al (2008) using a frequency tripled Nd:YAG laser.…”

Section: Introductionmentioning

confidence: 99%

Rapid micro hole laser drilling in ceramic substrates using single mode fiber laser

Adelmann

Hellmann

2015

Journal of Materials Processing Technology

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Rapid micro hole laser drilling in ceramic substrates using single mode fiber laser

Adelmann

Hellmann

2015

Journal of Materials Processing Technology

View full text Add to dashboard Cite

“…Engineers have pushed the limits of the feature size for LTCC conductors to tens of microns [16][17][18]. The current industrial standard for conductor track width and coupling gap is typically 75 µm to 100 µm, although 50 µm design features have also been demonstrated using screen printing [19].…”

Section: Introductionmentioning

confidence: 99%

A Two-Stage Process for Laser Prototyping of Microwave Circuits in LTCC Technology

Shafique

Robertson

2015

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

Abstract-An improved technique for laser prototyping of microwave circuits in LTCC technology is presented. This builds on previous work which demonstrated that laser machining of conductor layers on unfired LTCC tape could be used to fabricate multilayer microwave circuits without any patterned screens, stencils or masks. The improved process employs post-fire patterning of the top and bottom layer. In this way, sensitive microwave structures like couplers and filters can be fabricated on the outer layers because shrinkage uncertainty is no longer a problem. Track widths and gaps of 30 µm are demonstrated with edge definition of ±2 µm. A stripline coupler is successfully fabricated using this technique. The improved process can produce high precision microwave and millimeterwave components on the outer layers and provides rapid systemin-package prototyping for research and development.

show abstract