Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII 2017
DOI: 10.1117/12.2253634
|View full text |Cite
|
Sign up to set email alerts
|

Laser processing for precise fabrication of the THz optics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
7
0

Year Published

2018
2018
2022
2022

Publication Types

Select...
4
4

Relationship

1
7

Authors

Journals

citations
Cited by 10 publications
(7 citation statements)
references
References 10 publications
0
7
0
Order By: Relevance
“…They allow obtaining elements with large numerical aperture values (NA) and assure a compact optical setup configuration in comparison to refractive or reflective counterparts. Here, direct laser writing [ 68 ] (related to ablating the unwanted parts of the substrate layer) ensures proper manufacturing resolution. However, such a technique can be also used to manufacture phase structures with different number of phase steps [ 3 , 69 , 70 ] or even kinoform structures [ 71 ].…”
Section: Efficient Focusing Of Thz Radiationmentioning
confidence: 99%
“…They allow obtaining elements with large numerical aperture values (NA) and assure a compact optical setup configuration in comparison to refractive or reflective counterparts. Here, direct laser writing [ 68 ] (related to ablating the unwanted parts of the substrate layer) ensures proper manufacturing resolution. However, such a technique can be also used to manufacture phase structures with different number of phase steps [ 3 , 69 , 70 ] or even kinoform structures [ 71 ].…”
Section: Efficient Focusing Of Thz Radiationmentioning
confidence: 99%
“…However, a few of them were processed in an argon (Ar) atmosphere at a pressure of 1 or 2 atm. The samples were fabricated from a 500 ± 25 μm thick, both-sides polished, (100) crystal orientation highresistivity float zone silicon wafer that was similar to the ones used elsewhere [9], [12].…”
Section: Samples and Experimental Setupmentioning
confidence: 99%
“…The advantages of diffractive optics have been experimentally confirmed by demonstrating almost diffraction-limited imaging results [10], [11]. Silicon MPFLs have been fabricated using photo-lithography and the reactive ion etching technique [7] Manuscript received June 25, 2019; revised August 24, 2019 or using the maskless direct laser ablation (DLA) technology [12]. Moreover, the maskless laser patterning has been used to introduce additional functionalities in the MPFL, such as the phase-alteration structures working as both focusing and anti-reflective surfaces [13].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Silicon wafer of 0.46 mm thickness was patterned using an industrial-scale-compatible laser direct writing (LDW) system based on a 1064 nm wavelength, 13 ps pulse duration, 1 MHz repetition rate, 60 µJ peak energy laser (Atlantic 60 from Ekspla Ltd.) [6]. The LDW technology enabled us to manufacture different complexity multilevel zone-phase elements in the same process with the opportunity to modify parameters in time.…”
Section: Samples and Fabricationmentioning
confidence: 99%