Laser microvia formation in polyimide thin films for metallization applications

Abstract

Purpose -The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent in the construction of flexible circuits. Design/methodology/approach -The UV laser percussion drilling of microvias in 25 mm thick polyimide films with low coefficients of thermal expansion (CTE) and elastic modulii was investigated. Results were obtained using Scanning Electron Microscopy and Surface Profilometry. Polyimide films tested included: Duponte Kapton w EN; Kolon w GP and LV; Apical w NPI; and Taimidee TA-T. Findings -There was no direct relationship between the top and bottom diameters and ablation depth rates between the polyimide films tested using the same test conditions. There was a direct relationship with exit diameters and etch rates at different laser pulse frequency rates and fluence levels. Laser pulse rates at 30 kHz produced 20 per cent larger exit diameters than at 70 kHz, however at 70 kHz the first pulse etched 16.5 per cent more material. High fluence levels etched more material but with a lower etch efficiency rate. Other microvia quality concerns such as surface swelling, membrane residues on the bottom side and surface debris inside the microvias were observed. Nanoscale powder-like surface debris was observed on all samples in all test conditions. Originality/value -This is the first comparison of material specifications and costs for films from multiple polyimide manufactures and laser microvia drilling. The paper also is the first to demonstrate results using a JDSUe Lightwave Q302 w laser rail. The results provide the first insights into potential microvia membrane issues and debris characteristics.

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

“…This process can precisely remove polyimide material in a geometry defined by the laser beam; 129 thus, thermal side effects can be avoided 130 . The excimer laser has a broad range of UV wavelengths (157-353 nm), small feature size, and variable pulse width; thus, it is commonly used for the patterning of polyimide 131 . Schammler et al used an excimer laser with a wavelength of 248 nm for the laser etching of vias and lines on PI films; the sidewalls are straight and sloped between 60°and 85°1 32 .…”