Laser-induced prenucleation of alumina for electroless plating

2001

Aluminum specimens covered with anodic oxide films were scratched with an atomic force microscope ͑AFM͒ probe in air, pure water, CuSO 4 solutions, Cu-electroless plating solution, and diluted NaOH solutions to examine the effect of the probe load, scratch number, and processing environment on the rate of groove development. The rest potential of the aluminum was monitored during scratching in the solutions, and in situ AFM observations were carried out after the scratching. Probe wear was also examined in pure water and NaOH solution. The rate of groove development was in the order NaOH Ͼ CuSO 4 Ͼ air ϭ purewater Ͼ Cu-electroless solution, and decreased with decreasing probe load and increasing scratch number. The rest potential remained steady in the solutions during scratching with loads below 12.5 N, while it dropped rapidly above 25 N.Copper was deposited in and around grooves during scratching in Cu-SO 4 and Cu-electroless plating solution at the high loads, and after the scratching copper deposits grew only during immersion in Cu-electroless plating solution. Probe-tip wear was greater in NaOH solution than in distilled water.

mentioning

confidence: 99%

Fabrication of Grooves on Aluminum Surface with Atomic Force Microscope Probe Processing

Kato

2001

“…Laser-assisted electroless deposition and laser-induced prenucleation have been used to create selective seeds. [18][19][20][21][22][23] A palladium polyacrylic acid film is attached to the substrate and irradiated by a KrF excimer laser. Palladium ions are thus reduced to Pd 0 to become catalytic nuclei in subsequent electroless plating.…”

mentioning

confidence: 99%

Copper Electroless Plating at Selected Areas on Aluminum with Pulsed Nd‐YAG Laser

Chu

2000

Local deposition of copper on aluminum was attempted by the successive processes of anodizing, laser irradiation, and electroless plating. Aluminum specimens covered with anodic oxide films were immersed in Cu 2 + , Cu 2 + / H 2 PO 2 − , and diluted NaOH solutions, and irradiated with a pulsed yttrium aluminum garnet (YAG) laser. The time variation in the rest potential of the specimens was followed during laser irradiation by a potentiometer, and the change of the surface composition by laser irradiation was examined by X‐ray photoelectron spectroscopy (XPS). After the laser irradiation, copper electroless plating was carried out in ( Cu 2 + , Ni 2 + ) / H 2 PO 2 − solutions with or without Pb 2 + or thiourea. The rest potential measurements and XPS analysis suggested that Cu particles nucleate at the film‐removed area by laser irradiation in Cu 2 + and Cu 2 + / H 2 PO 2 − solutions. A copper layer was obtained at the irradiated area by the subsequent electroless plating, and the copper nuclei acted as catalytic centers at the very initial stage in copper electroless plating. The effects of Pb 2 + and thiourea concentration and the deposition temperature on the kinetics of copper deposition is also discussed. © 2000 The Electrochemical Society. All rights reserved.

“…Laser-assisted deposition has also been investigated for microstructure fabrication. [21][22][23][24][25] Generally, a UV excimer laser is used to assist the electroless deposition or induce metal seeding locally at room temperature. This technique is mainly applied to nonconductors such as polymers, ceramics, glass, etc.…”

mentioning

confidence: 99%

“…The movement of the specimen was computer-controlled in three dimensions, and a diagram of this experimental setup is detailed elsewhere. 25 In a preliminary experiment, the laser beam diameter on the focal plane was determined at about 400 m by measuring the spot size of the filmremoved area produced with one pulsed laser shot.…”

mentioning

confidence: 99%

Local Deposition of Ni‐P Alloy on Aluminum by Laser Irradiation and Electroless Plating

Chu

et al. 1999

A new technique on local modification of aluminum was attempted by combining anodization, laser irradiation, and electroless plating. Aluminum specimens covered with a porous anodic oxide film were immersed in Ni2+/H2PO2− solution containing Pb2+ ions at CnormalPb2+=0–2.4 normalppm and irradiated at 293 K with a pulsed yttrium aluminum garnet (YAG) laser through a lens and quartz window to remove the oxide film locally. The specimen was then transferred into the Ni2+/H2PO2− solution at 358–368 K to deposit Ni‐P alloys on the aluminum by electroless plating. Local deposition of amorphous Ni‐P alloys (9.5–11.2 atom % P) at the laser‐irradiated area was obtained at CnormalPb2+=0.3–2.4 normalppm above 358 K. The effects of CnormalPb2+ on the rate of Ni‐P electroless deposition as well as on the morphology and crystal structure of Ni‐P deposits were also investigated. It was found that the addition of Pb2+ ions to the solution leads to the deposition of Ni‐P alloys with a smooth surface and that it slightly affects the composition and crystal structure of the deposits. © 1999 The Electrochemical Society. All rights reserved.