Laser‐induced front side etching of fused silica with KrF excimer laser using thin chromium layers

Lorenz, Pierre; Ehrhardt, Martin; Zimmer, Klaus

doi:10.1002/pssa.201127672

Cited by 16 publications

(6 citation statements)

References 22 publications

(21 reference statements)

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“…The initial pulses presented a lower etching depth than the following ones. This effect is already discussed in [18]. At a layer thickness of 50 nm one initial pulse is sufficient and for pulses more than one a constant etching depth is achieved.…”

Section: Nanosecond Excitation At 248 Nm and 351 Nm A Etching Depth mentioning

confidence: 73%

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Laser-induced front side etching of fused silica with short and ultra-short laser pulses

2012

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The patterning or figuring of fused silica, e.g. for optical components, requires sophisticated methods. The usage of laser radiation enables a fast as well as high-quality machining of transparent materials. In particular, the laser-induced front side etching (LIFE) method has an excellent potential for nm-precision structuring of dielectrics with a high surface quality. At the LIFE process the laser beam interacts with an absorber layer on top of the front side of the dielectric surface to be machined. Here, the LIFE of fused silica is studied by using laser radiation with a wavelength from ultraviolet to infrared with pulse durations from nanosecond to femtosecond. With all investigated laser sources a welldefined, nm-precise etching of fused silica by the LIFE process is possible. A linear dependence of the etching depth on the laser fluence can be found whereas etching depths up to 300 nm can be achieved. The optimal laser fluence ranges as well as the achievable etching depths are dependent on the laser radiation used for the LIFE process.

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Section: Nanosecond Excitation At 248 Nm and 351 Nm A Etching Depth mentioning

confidence: 73%

“…The high laser fluence tends to an increased surface roughness. More details about the LIFE process with ns laser radiation can be found in previous publications [14,18,19].…”

Section: Nanosecond Excitation At 248 Nm and 351 Nm A Etching Depth mentioning

confidence: 99%

Laser-induced front side etching of fused silica with short and ultra-short laser pulses

2012

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“…In the laser-induced front side etching (LIFE), the laser beam is directly focused onto the front side of the transparent substrates, which avoids the issues of absorption and interference from the substrate material [156][157][158] . With the aim of increasing laser energy absorption, a thin absorber layer is deposited on the front surface, such as chromium 159,160 , aluminum 161 , silver 160 , titanium 160 , and silicon monoxide layer 156 . Comparative studies show that the single-shot ablation thresholds for various glass samples can be reduced by 2 orders of magnitude (from hundreds of J/cm 2 to a few or tens of J/cm 2 ) with the absorber layer 161 .…”

Section: Laser-induced Front Side Etchingmentioning

confidence: 99%

Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications

2021

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Laser has been demonstrated to be a mature and versatile tool that presents great flexibility and applicability for the precision engineering of a wide range of materials over other established micromachining techniques. Past decades have witnessed its rapid development and extensive applications ranging from scientific researches to industrial manufacturing. Transparent hard materials remain several major technical challenges for conventional laser processing techniques due to their high hardness, great brittleness, and low optical absorption. A variety of hybrid laser processing technologies, such as laser-induced plasma-assisted ablation, laser-induced backside wet etching, and etching assisted laser micromachining, have been developed to overcome these barriers by introducing additional medium assistance or combining different process steps. This article reviews the basic principles and characteristics of these hybrid technologies. How these technologies are used to precisely process transparent hard materials and their recent advancements are introduced. These hybrid technologies show remarkable benefits in terms of efficiency, accuracy, and quality for the fabrication of microstructures and functional devices on the surface of or inside the transparent hard substrates, thus enabling widespread applications in the fields of microelectronics, bio-medicine, photonics, and microfluidics. A summary and outlook of the hybrid laser technologies are also highlighted.

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“…with HF acid [10]. Besides the direct ablation process the laser etching methods [11][12][13][14] allow the fabrication of vertical nm-precision and lateral sub-m-precision structures in dielectrics with a very low surface roughness.…”

Section: Introductionmentioning

confidence: 99%

Nanodrilling of fused silica using nanosecond laser radiation

Lorenz

Zajadacz

Bayer

et al. 2015

Applied Surface Science

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Laser‐induced front side etching of fused silica with KrF excimer laser using thin chromium layers

Cited by 16 publications

References 22 publications

Laser-induced front side etching of fused silica with short and ultra-short laser pulses

Laser-induced front side etching of fused silica with short and ultra-short laser pulses

Hybrid laser precision engineering of transparent hard materials: challenges, solutions and applications

Nanodrilling of fused silica using nanosecond laser radiation

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