Laser Induced Forward Transfer of High Viscosity Silver Paste for New Metallization Methods in Photovoltaic and Flexible Electronics Industry

Chen, Y.; Muñoz-Martín, D.; Morales, M.; Molpeceres, C.; Sánchez‐Cortezón, Emilio; Murillo-Gutierrez, J.

doi:10.1016/j.phpro.2016.08.010

Cited by 27 publications

(17 citation statements)

References 11 publications

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“…The printing conductive lines over long distances (20 µm wide Ag lines up to 3 mm lengths) can be realized by using different conjoining geometries . This ability make LIFT a powerful tool for printing metallic components in electronics devices and allow the use of polymer substrates for flexible electronic applications, which has been demonstrated in printing free‐form metallization patterns onto the flexible solar cells, stretchable and transparent electrodes, ferrocene pixels and lines onto flexible PDMS substrates for flexible microelectrode fabrication, and a humidity sensor device on a piece of paper …”

Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

105

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materials and enable innovative applications that are hard to achieve with current microelectronics. Examples vary from biointegrated devices for clinical diagnosis and treatment, [11][12][13] to electronic skin (E-Skin), [14][15][16] energy harvesting/storage devices, [17][18][19][20][21] and sweat sensor, [22,23] to flexible display, [24,25] and to RFID tags, [26,27] etc.Two main kinds of microfabrication processes have been developed for flexible electronics, including the solutionprocessable methods and vacuum-based methods (lithographic patterning and undercut etching). [28] The former is naturally compatible with flexible substrates and can deposit and pattern functional materials in one single step. [29][30][31] They have fabricated various printed electronics with increasing performance, such as conductive metal wires, [32][33][34] thin film transistors (TFTs), [35][36][37] and piezoelectric devices. [38][39][40][41] However, the electronic performance is still limited by the properties of solution-processable functional materials and low resolution of printing techniques, with respect to standard microfabrication process. [42] On the other side, vacuum-based microfabrication techniques provide wellestablished routes to realize high-performance electronics, but generally incompatible with large-area, flexible (polymeric substrates). Ideally, high performance flexible electronics systems are usually fabricated by built-up process that begins with independent fabrication of high-modulus, fragile, chip-scale elements (e.g., IC chips, MEMS, sensors, and power sources) or flexible devices (e.g., flexible sensor, flexible display, and TFT array) on donor wafers, followed by being transferred onto flexible/stretchable substrates.The above manufacturing routes of flexible electronics can be concluded as the transfer of the materials, components, and devices from original fabricated/prepared substrates to flexible ones. The most significant built-in challenge in transferring is to control of interface status to accommodate to the disparate nature of the transferred objects from donor wafer/substrate. Distinctive assembly techniques based on stress-induced interface fracture have been invented to be adaptive to the diversity of material properties and geometric sizes that lead to tremendous differences in mechanical properties. For those conventional rigid electronic components like IC chips, they are transferred by standard single-ejector needle pick-and-place It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible subst...

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Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

105

View full text Add to dashboard Cite

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“…The width of the line is 134 ± 2 µm and the height of the line is 33 ± 1 µm (each value represents the average of five measurements in different positions with an uncertainty denoting one standard deviation). With such a profile, ps-pulsed LIFT lines can provide good electrical conductivity [17].…”

Section: Influence Of the Laser Fluencementioning

confidence: 99%

Overlapping Limitations for ps-Pulsed LIFT Printing of High Viscosity Metallic Pastes

Muñoz-Martín

Chen

Morales

et al. 2020

Metals

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Laser-induced forward transfer (LIFT) technique has been used for printing a high viscosity (250 Pa·s) commercial silver paste with micron-size particles (1–4 µm). Volumetric pixels (voxels) transferred using single ps laser pulses are overlapped in order to obtain continuous metallic lines. However, interference problems between successive voxels is a major issue that must be solved before obtaining lines with good morphologies. The effects of the laser pulse energy, thickness of the donor paste film, and distance between successive voxels on the morphology of single voxels and lines are discussed. Due to the high viscosity of the paste, the void in the donor film after a printing event remains, and it negatively affects the physical transfer mechanism of the next laser pulses. When two laser pulses are fired at a short distance, there is no transfer at all. Only when the pulses are separated by a distance long enough to avoid interference but short enough to allow overlapping (≈100 µm), is it possible to print continuous lines in a single step. Finally, the knowledge obtained has allowed the printing of silver lines at high speeds (up to 60 m/s).

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“…Chen et al demonstrated the use of the LIFT technique for high-viscosity silver paste as a new metallization method for photovoltaics and flexible electronics (Chen et al 2016). They used the commercial silver-based pastes initially designed for solar cell screen printing, demonstrating the easy adaptability to replace traditional paste deposition and firing methods.…”

Section: Laser-induced Forward Transfer (Lift)mentioning

confidence: 99%

Laser-Induced Surface Modification for Photovoltaic Device Applications

Gupta¹

2020

Handbook of Laser Micro- And Nano-Engineering

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High-power lasers are extensively used for the fabrication of photovoltaic devices, medical devices, electronics and MEMS packaging, photonic device integration, consumer electronic devices such as smartphones, organic lightemitting diodes (OLED), and semiconductor devices and in the area of printed circuit boards. In the area of photovoltaic device fabrication, lasers are used for microtexturing of surfaces to improve light-trapping properties, laser doping to make n-and p-type semiconductors, electrical contacts, electrical isolation,

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Laser Induced Forward Transfer of High Viscosity Silver Paste for New Metallization Methods in Photovoltaic and Flexible Electronics Industry

Cited by 27 publications

References 11 publications

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Overlapping Limitations for ps-Pulsed LIFT Printing of High Viscosity Metallic Pastes

Laser-Induced Surface Modification for Photovoltaic Device Applications

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