Laser heating and melting of thin films on low-conductivity substrates

Abstract

A laser beam, incident on a highly absorbent thin film supported by a poorly conductive substrate, causes that film to heat and melt. The time required to reach the melting point and that required to complete the melting process are calculated as a function of the incident laser flux. The calculations neglect heat losses arising from lateral diffusion, convection, and thermal radiation, but they account for a possible reflectivity change at the melting point. They yield a criterion for the minimal absorbed flux necessary to maintain stable monotonic melting.

Laser thermal response of a finite slab as a function of the laser pulse parameters

“…High-power density laser is applicable in different aspects of material processing techniques, such as spot welding, scribing, drilling of holes, laser cutting and laser glazing [1][2][3][4][5][6]. In the semiconductor industry, it is used for local diffusion and alloying to form p-n junctions.…”

On the evaporation of a semi-infinite target induced by a pulsed laser

“…(7) at the end of the laser pulse shows that the R.H.S is 15% greater than the L.H.S. This increasing is due to the approximation used in the development of the equations and the difficulty inARTICLE IN PRESS Fig.…”

“…Several authors have considered different aspects in treating these problems [5][6][7][8][9][10][11][12][13][14][15][16]. Carslaw and Jaeger [17] have used the Laplace transformation for solving problems in the linear flow of heat through different target configurations such as infinite solid target , semiinfinite as well as problems on the cylinder and sphere solid target.…”

Heating Two-Layer System with Pulsed Laser

“…Laser pulses of moderate power are used in a variety of fields, for example, to alter thin films on low-conductivity substrates especially for information recording [2][3][4][5][6].…”

“…It has different industrial applications, especially in the fields of material processing, such as spot welding, scribing, drilling of holes, laser cutting and laser glazing [1][2][3][4][5].…”