Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties

Li, Xinxin; Wang, Yimeng

doi:10.3390/mi12030262

Cited by 6 publications

(2 citation statements)

References 24 publications

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“…Monocrystalline silicon is the most popular substrate material used in the production of integrated circuits (IC) and is regarded as the foundation of many electronic devices [1][2][3]. Wafer surface quality is significant because it can enhance the performance and lifespan of IC devices [4,5].…”

Section: Introductionmentioning

confidence: 99%

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Wu,

Cheng,

Zhang

et al. 2023

J. Phys.: Conf. Ser.

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The grind-polishing wheel is a new non-woven structure grinding tool with low elastic modulus and ultra-fine abrasive grains, which can obtain high surface/sub-surface quality ground silicon wafers. To obtain high-shape flatness during grinding with the grind-polishing wheel, a prediction model of the ground silicon wafers’ flatness considering the elastic modulus of the wheel, processing parameters, and abrasive grain size is developed. The grinding experiments under different speed ratios were conducted to verify the prediction model accuracy. It shows that the model can successfully predict the flatness of ground silicon wafers, and the error of the prediction model is less than 13%. The proposed model has some guiding significance for choosing the appropriate character of the grind-polishing wheel and grinding parameters to achieve desirable flatness for silicon wafers.

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Section: Introductionmentioning

confidence: 99%

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Wu,

Cheng,

Zhang

et al. 2023

J. Phys.: Conf. Ser.

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“…In recent years, laser processing, an alternative process of mechanical grinding, has received significant attention. Li et al 19 first reported the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. In the report, they demonstrated that SiO 2 layer and Ra were reduced after femtosecond laser grinding.…”

mentioning

confidence: 99%

A Novel Strategy Achieving GaN Ultra-Smooth Surface via a Square, Flat Top Beam Shaped Femtosecond Laser Processing Combined with Chemical Mechanical Polishing

Chen¹,

Peng²,

Long³

et al. 2022

ECS J. Solid State Sci. Technol.

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We propose a strategy for GaN ultra-smooth manufacture by combining femtosecond laser processing and chemical mechanical polishing. The optimized flat top beam is used to redistribute the laser fluence from Gaussian distribution to square, flat top profile. A surface with high flatness is achieved after femtosecond laser processing through optimization of the technical parameters. The optimum process to control the damage on the surface and subsurface reduces negative influence of femtosecond laser processing on chemical mechanical polishing. Roughness (Ra) of the processed surface is decreased to less than 0.1 nm when it is polished for 6 hours. Because traditional GaN polishing efficiency faces a bottleneck, the present study proposes using a square, flat top beam shaped femtosecond laser to induce the surface of GaN. Structures and composition on induced surface are simultaneous removed in the chemical mechanical polishing process, reducing the burden of GaN chemical mechanical polishing. This method has the advantage of high efficiency and easy realization, with a wide range of applications in GaN ultra-smooth processing.

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Recent Development of Low Damage Laser Microprocessing on Surface and Subsurface Treatment of Silicon for Industrial Applications

Li,

Guan

2024

Lecture Notes in Mechanical Engineering

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Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties

Cited by 6 publications

References 24 publications

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

A Novel Strategy Achieving GaN Ultra-Smooth Surface via a Square, Flat Top Beam Shaped Femtosecond Laser Processing Combined with Chemical Mechanical Polishing

Recent Development of Low Damage Laser Microprocessing on Surface and Subsurface Treatment of Silicon for Industrial Applications

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