Laser drilling of microvias in epoxy-glass printed circuit boards

Kestenbaum, A.; D'Amico, John; Blumenstock, B. J.; DeAngelo, M.A.

doi:10.1109/33.62548

Cited by 26 publications

(9 citation statements)

References 2 publications

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“…The formation of vertical interconnections (vias) in PCB also makes use of laser beam for drilling [46][47][48][49]. Hard and brittle composite materials like marble, stone and concrete have wide applications in the field of civil structures.…”

Section: Lbm Applicationsmentioning

confidence: 99%

Laser beam machining—A review

Dubey¹,

Yadava²

2008

International Journal of Machine Tools and Manufacture

731

230

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Section: Lbm Applicationsmentioning

confidence: 99%

Laser beam machining—A review

Dubey¹,

Yadava²

2008

International Journal of Machine Tools and Manufacture

731

230

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“…PWB via sizes have been in the range 250 to 400 µm for several decades. Though early work in laser via formation was carried out in the early 1990s, [2][3][4] it was only with the advent of High-Density Interconnect (HDI) circuit design rules in the mid 1990's that significant market demand developed for much smaller vias. Mechanical drilling machines today are capable of reliably drilling vias down to about 150 µm diameter, and work is progressing toward 100 µm.…”

Section: Electronic Packaging and Via Drillingmentioning

confidence: 99%

High-speed microvia formation with UV solid-state lasers

Dunsky

2002

Proc. IEEE

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Laser drilling has emerged in the last five years as the most widely accepted method of creating microvias in high-density electronic interconnect and chip packaging devices. Most commercially available laser drilling tools are currently based on one of two laser types: far-IR CO 2 lasers and UV solid state lasers at 355 nm. While CO 2 lasers are recognized for their high average power and drilling throughput, UV lasers are known for high precision material removal and their ability to drill the smallest vias, with diameters down to about 25-30 m now achievable in production. This paper presents an historical overview of techniques for drilling microvias with UV solid state lasers. Blind and through via formation by percussion drilling, trepanning, spiralling, and image projection with a shaped beam are discussed. Advantages and range of applicability of each technique are summarized. Drivers of throughput scaling over the last five years are outlined and representative current-generation performance is presented.

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“…Laser micro machining has found expanded use in automobile, aerospace, and electronics industries because of the possibility of making small and unique structures that are difficult to achieve with conventional methods. Recently, many new applications with economic implications have also been identified, such as fabrication of micro mechanical components [1,2] and micro processing in microelectronics [3,4,5]. Despite these developments, the advancement of laser drilling has been slow even after decades of use.…”

Section: Introductionmentioning

confidence: 99%

“…Precision micromachining on metals, however, still has not been realized because of the problems of large dimensional error and large hole taper [5,6,7], in addition to the formation of recast layer and heat affected zone. Although trepanning technique has been applied to improve the accuracy of laser micro drilling, its hole aspect ratio was mostly limited to less than 1 : 1.…”

Section: Introductionmentioning

confidence: 99%

Precision micro drilling with copper vapor lasers

Chang¹,

Martinez²,

Warner³

et al. 1994

International Congress on Applications of Lasers &Amp; Electro-Optics

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Thisisa preprint of apaper intended forpublication in a jonrnalor proceedings Since changes may be made before publication, this preprint is made available with the understanding that it will not be cited or reproduced without the permission of the author. , This document was prepared as an account of work'&onsored by an agency of ' the United States Government. Neither the United States Government nor the university of California nor any of their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not n d y constitute or imply its endorsement, recommendation, or favoring by the United States Government or the University of California The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or the University of California, and shall not be used for advertising or product endorsement purposes.

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Laser drilling of microvias in epoxy-glass printed circuit boards

Cited by 26 publications

References 2 publications

Laser beam machining—A review

Laser beam machining—A review

High-speed microvia formation with UV solid-state lasers

Precision micro drilling with copper vapor lasers

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