Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards

Hirogaki, Toshiki; Aoyama, Eiichi; Inoue, Hisahiro; Ogawa, Keiji; Maeda, Shunsuke; Katayama, Tsutao

doi:10.1016/s1359-835x(00)00152-4

Cited by 52 publications

(24 citation statements)

References 7 publications

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“…They reported that grooving the laminate surface parallel to the fiber orientation produced a narrower heat affected zone than processing in a direction perpendicular to the fiber orientation. Laser drilling of blind via holes in Aramid and glass epoxy composites was carried out by Hirogaki et al [5]. They showed that the drilling time was short and laser drilled via holes had a uniform taper to the sidewall.…”

Section: Introductionmentioning

confidence: 99%

Laser cutting of Kevlar laminates: First and second law analysis

et al. 2011

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Kevlar laminates are difficult to machine using conventional machining methods because of their thermal and mechanical properties. Laser cutting offers advantages over conventional machining methods, such as precision of operation, non-frictional processing, and operational cost. This provides the motivation for the present study, which reports on laser cutting of Kevlar laminates of different thicknesses. The first and second law efficiencies of the cutting process are formulated and predicted in line with the experimental parameters. The laser cut surfaces are examined using optical and electron scanning microscopes. It is demonstrated that the first and second law efficiencies improve at high laser cutting speeds and low laser output power levels. For these conditions parallel sided kerfs with no sideways burning are produced.

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Section: Introductionmentioning

confidence: 99%

Laser cutting of Kevlar laminates: First and second law analysis

et al. 2011

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“…Surface marking and micro-hole drilling are among the more common applications of high power lasers due to the simplicity and speed of operation [1]. New applications in the field of micro-optical and micro-electromechanical systems (MEMS) are also emerging, where the surface features are more complex and require variable removal of material from a substrate [2].…”

Section: Introductionmentioning

confidence: 99%

A study of angular dependence in the ablation rate of polymers by nanosecond pulses

Pedder

Holmes

2006

Photon Processing in Microelectronics and Photonics V

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Measurements of ablation rate have traditionally been carried out only at normal incidence. However, in real-world applications ablation is often carried out at oblique angles, and it is useful to have prior knowledge of the ablation rate in this case. Detailed information about the angular dependence is also important for the development of ablation simulation tools, and can provide additional insight into the ablation mechanism. Previously we have reported on the angular dependence of direct-write ablation at 266 nm wavelength in solgel and polymer materials. In this paper we present a systematic study of angular dependence for excimer laser ablation of two polymer materials of interest for microfabrication: polycarbonate and SU8 photoresist. The results are used to improve simulation models to aid in mask design.

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“…As such, it has become necessary to use fiberreinforced plastics (FRP) for the insulation layer. Aramid fiber reinforced plastic (AFRP) is considered to be a suit-able material for the build-up layers because it allows high-efficiency laser drilling (3), (4) . Laser drilling methods are frequently used to form blind via holes in the insulation layer.…”

Section: Introductionmentioning

confidence: 99%

Data-Mining of Factors Affecting Circuit Connection Reliability on Laser-Drilled Micro Blind via Holes in Multi-Layer PWBs

Ogawa¹,

Hirogaki²,

Aoyama³

et al. 2006

JSME Int. J., Ser. A

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The purpose of the present study is to analyze the circuit connection reliability of printed wiring boards (PWBs) in relation to the thermal stresses obtained by FEM and to apply the FEM data to a data-mining method in order to clarify the factors that influence the thermal stress of the copper plating on the drilled hole walls. The following are the conclusions obtained herein: (1) Decreasing the thickness of the build-up layer is effective in reducing the thermal stress of the copper plating. (2) Using the data-mining method, new factors that were hidden in the data, such as the coefficient of thermal expansion in the Z direction, were revealed, despite the presence of other complex factors.

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Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards

Cited by 52 publications

References 7 publications

Laser cutting of Kevlar laminates: First and second law analysis

Laser cutting of Kevlar laminates: First and second law analysis

A study of angular dependence in the ablation rate of polymers by nanosecond pulses

Data-Mining of Factors Affecting Circuit Connection Reliability on Laser-Drilled Micro Blind via Holes in Multi-Layer PWBs

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