Laser dicing for higher chip productivity

Suzuki, Natsuki; Xiao, Shiqin; Atsumi, K.; Uchiyama, Naoki; Ohba, Takayuki

doi:10.1109/impact.2016.7799992

Cited by 3 publications

(1 citation statement)

References 4 publications

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“…As the size of silicon wafers increases, the wafers that have gone through the thinning phase of the process are prone to chip breakage with the conventional blade dicing method, which leads to a decrease in product yield [4]. As a usual dicing method for wafer dicing processes, the blade dicing produces mechanical vibrations and stress within the wafer, resulting in chip cracks and chippings [5]. The extent of this damage increases with increasing dicing speed, especially when cutting the thinner wafers at a higher speed, the blade dicing can significantly reduce the process yield of a wafer [6].…”

Section: Introductionmentioning

confidence: 99%

High-speed and high-precision control of laser stealth dicing equipment based on interpolation and fitting

Xu,

Song

et al. 2023

J. Phys.: Conf. Ser.

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As an advanced wafer dicing technology, stealth dicing has the advantage of better-cutting quality and faster-cutting speed than traditional blade dicing technology and has a broad application prospect for the future cutting of large and ultra-thin silicon wafers. The stealth dicing equipment involves two processes, i.e., wafer altimetry and follow-through processing in silicon wafer cutting, the altimetry accuracy of which determines the processing precision. In this paper, polynomial fitting, linear interpolation, and cubic spline interpolation are applied to predict the altimetry data at different speeds to achieve high-speed and high-precision altimetry under various speed conditions. The research shows that the prediction accuracy of the three methods is less than 1 μm. The linear interpolation has the highest accuracy during the altimetry speeds of 500 mm/s ~ 1500 mm/s. The polynomial fitting can achieve better prediction results by selecting the best fitting parameter when the altimetry speeds are 1500 mm/s ~ 2500 mm/s. The cubic spline interpolation is more suitable for the processing of data sampled at altimetry speeds between 2500 mm/s and 3000 mm/s.

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Section: Introductionmentioning

confidence: 99%