Laser Beam Activation of CNT‐Filled Polymer Blends

Abstract

Abstract3D‐Molded Interconnect Devices enable the placement of electronic circuits on three‐dimensional plastic components. The following article breaks new ground in order to add reasonably to existing 3D‐MID procedures. An essential aspect was the shortening of the process chain of the conventional MID procedures through laser‐direct structuring. Thus the metallising steps are no longer necessary and a 3D circuit carrier structure can be created directly on any plastic component. The research work focused on the space‐resolved modification of the electric conductivity of non‐conductive plastic components through a newly‐developed procedure of laser beam functionalisation. The principle is based on the application of multi‐phase polymer blends with matrix‐disperse phase structures in which carbon nanotubes are located. They cross‐link on the component surface through a partial laser activation and create a conductive area.

Additive and Photochemical Manufacturing of Copper

“…This platform opens up a novel area for applying the LIFT process as a low-cost and high throughout technique for 3D printing of metallic circuits onto various types of substrates. This novel LIFT method is envisioned to have a wide range of vital applications, such as biomedical sensors48, molded interconnect devices56, 3D micro batteries57, and microfluidics58. In addition to copper, the other metals shown in Table S1 might also be printed by this novel platform which will be studied in future research, with the laser source having the appropriate wavelength.…”