DOI: 10.1002/9780470294444.ch32
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Laser-Based Optical Scattering Detection of Surface and Subsurface Defects in Machined Si3N4 Components

Abstract: This report was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor any agency thereof, nor any of their employees, make any warranty, e x p m or implied, or assumes any legal liabiity or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, proce… Show more

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Cited by 5 publications
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“…Therefore, only the light reflected from the focal point in the sample goes through the detection pinhole and is then received. The confocal microscopy provides higher resolution detection compared to the traditional microscopy, and has been applied to detecting SSD in ceramics [15,82], optical parts [83] and semiconductor materials [5].…”
Section: Laser Scatteringmentioning
confidence: 99%
See 2 more Smart Citations
“…Therefore, only the light reflected from the focal point in the sample goes through the detection pinhole and is then received. The confocal microscopy provides higher resolution detection compared to the traditional microscopy, and has been applied to detecting SSD in ceramics [15,82], optical parts [83] and semiconductor materials [5].…”
Section: Laser Scatteringmentioning
confidence: 99%
“…The Argonne National Laboratory and the Kansas State University jointly developed the cross-polarization confocal microscopy (CPCM) to measure SSD in the ground ceramics and silicon wafers [5,15,[85][86][87][88][89][90][91][92]. As shown in Figure 8, an incident light is linearly polarized and hits the surface of a sample.…”
Section: Laser Scatteringmentioning
confidence: 99%
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“…The corresponding morphology in section, investigated by TEM analysis (images not shown), reveals a damaged region with lateral and median cracks extending for a depth of about 600 nm. This damaged region is an area with high density dislocations and large strain [8,9]. Despite the same grinding process has been performed on all SiC wafers under investigation, different Cbow values have been measured as it is possible to see from data collected in fig.…”
Section: Resultsmentioning
confidence: 99%
“…Laser scatter technology is a high precision method used to detect ceramic defects as small as 10μm. But only specimens with artificial cracks and subsurface cracks were detected [8,9].…”
Section: Introductionmentioning
confidence: 99%