International Congress on Applications of Lasers &Amp; Electro-Optics 2007
DOI: 10.2351/1.5061145
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Laser-based glass soldering for MEMS packaging

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“…Creation of a strong joint of materials that demonstrate different physical and chemical properties is an important step in the development of the technologies for the fabrication of microfluidic devices, microchip lasers, and sensors. The most common bonding methods for glass‐based materials are optical contact, 1 bonding by adhesives 2 and solders, 3 various types of welding, including diffusion welding, 4 laser welding with CO 2 , and solid‐state lasers, 5 anodic bonding 6 . All these methods have a number of disadvantages and limitations that stimulate the search for new approaches to effective materials joining.…”
Section: Introductionmentioning
confidence: 99%
“…Creation of a strong joint of materials that demonstrate different physical and chemical properties is an important step in the development of the technologies for the fabrication of microfluidic devices, microchip lasers, and sensors. The most common bonding methods for glass‐based materials are optical contact, 1 bonding by adhesives 2 and solders, 3 various types of welding, including diffusion welding, 4 laser welding with CO 2 , and solid‐state lasers, 5 anodic bonding 6 . All these methods have a number of disadvantages and limitations that stimulate the search for new approaches to effective materials joining.…”
Section: Introductionmentioning
confidence: 99%