Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating – Process and activation mechanism

Ratautas, Karolis; Andrulevičius, Mindaugas; Jagminienė, Aldona; Stankevičienė, Ina; Norkus, Eugenijus; Račiukaitis, Gediminas

doi:10.1016/j.apsusc.2018.11.091

Cited by 39 publications

(38 citation statements)

References 20 publications

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“…One of the most promising technologies to overcome the aforementioned challenges is the selective surface activation induced by laser (SSAIL) [ 11 , 12 ]. The process includes laser modification of the polymer surface with a short-pulse laser, chemical activation of laser-modified areas and electroless metal deposition on the locally activated surface.…”

Section: Introductionmentioning

confidence: 99%

Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

et al. 2020

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The selective surface activation induced by laser (SSAIL) for electroless copper deposition on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend is one of the promising techniques of electric circuit formation on free-shape dielectric surfaces, which broadens capabilities of 3D microscopic integrated devices (3D-MIDs). The process consists of laser excitation, chemical activation of laser-excited areas by dipping in a liquid and electroless copper deposition of the laser-treated areas. The limiting factor in increasing throughput of the technology is a laser activation step. Laser writing is performed by modern galvanometric scanners which reach the scanning speed of several meters per second. However, adverse thermal effects on PC/ABS polymer surface abridge the high-speed laser writing. In this work, an investigation was conducted on how these thermal effects limit surface activation for selective metal deposition from the view of physics and chemistry. An advanced laser beam scanning technique of interlacing with precise accuracy and the pulse-on-demand technique was applied to overcome mentioned problems for fast laser writing. Initially, the modelling of transient heat conduction was performed. The results revealed a significant reduction in heat accumulation. Applied methods of laser writing allowed the overall processing rate to increase by up to 2.4 times. Surface morphology was investigated by a scanning electron microscope. Energy-dispersive X-ray spectroscopy was used to investigate the modification of atomic concentration on the surface after laser treatment. Experiments did not show a correlation between surface morphology and electroless plating on laser-treated areas. However, significant variation in the composition of the material was revealed depending on the surface activity for electroless plating.

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Section: Introductionmentioning

confidence: 99%

Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

et al. 2020

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“…The LDS mechanism is as follows: when the metal oxide in a polymer is broken down by the photochemical reactions of a high‐powered laser such as over 4 J cm −2 , the metal oxide is converted to an activated metal particle, which can be utilized as a deposition seed. When electroless plating is then carried out, the deposition seed acts as an initiator material on which the metal ion can be deposited . A complete circuit is formed when the deposited metal particles bond with each other.…”

Section: Process Mechanismsmentioning

confidence: 99%

Fabrication of Conductive Patterns on 3D Printed Structure Using Photo‐Polymerization Technology

Choi

Park

2019

Physica Status Solidi (a)

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3D printing technology is attracting considerable attention as it can be used to produce complex-shaped structures quickly. Recently, in addition to the production of simple-shaped parts, the manufacturing of embedded products with conductive patterns using 3D printing has increased. However, previous studies have limitations on conductivity, stability, and process complexity. Therefore, in this paper, a novel manufacturing process is proposed. It uses the same laser energy source of photo-polymerization technology, which is a general 3D printing technology, to create a circuit pattern with high conductivity immediately after the structure is printed. This concept is based on two technologies: a laser direct structuring process and metal photopolymerization. Moreover, with this technique, it is possible to produce structures and conductive patterns using a single laser-based machine. Therefore, alignment tolerance can be ignored during production. After additional metal deposition, the structure can achieve stable and high conductivity. The pattern produced by this novel manufacturing process has a resistance of 0.5 Ω cm -1 , and the feasibility of the circuit is illustrated with a light-emitting diode demonstration. This method is expected to be helpful for both shape production and the development of products that perform electrical functions.

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“…Considering this, we proposed a versatile method of Selective Surface Activation Induced by a Laser (SSAIL) for metallization of dielectric substrates, which does not require expensive precursors and permits a high fabrication speed. [41][42][43] The process includes laser modication of the polymer surface with a short-pulse laser, chemical activation of the laser-modied areas and electroless metal deposition on the locally activated surface. In the last step (electroless plating), in situ growth of metal particles occurs on the electrode eliminating the necessity for an additional stage of immobilisation or deposition of particles on the surface.…”

Section: Introductionmentioning

confidence: 99%

High rate fabrication of copper and copper–gold electrodes by laser-induced selective electroless plating for enzyme-free glucose sensing

et al. 2021

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Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating – Process and activation mechanism

Cited by 39 publications

References 20 publications

Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

Fabrication of Conductive Patterns on 3D Printed Structure Using Photo‐Polymerization Technology

High rate fabrication of copper and copper–gold electrodes by laser-induced selective electroless plating for enzyme-free glucose sensing

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