Laser ablation of diamond films in various atmospheres

Gloor, S.; Pimenov, S.M.; Obraztsova, E. D.; Lüthy, W.; Weber, Hubert

doi:10.1016/s0925-9635(97)00288-4

Cited by 29 publications

(11 citation statements)

References 5 publications

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“…Based on the previous research progress, the researchers have a deep understanding of the different variables in the ablation process by comparing the sample quality under different processing parameters. ArF laser (λ=193nm, τ=20ns) ablation of diamond films in different atmospheres (H2, He, O2, N2, vacuum, air) was discussed by Gloor et al [17] in 1998.…”

Section: Progress Of Laser Polishingmentioning

confidence: 99%

Progress in diamond polishing with light source assistance

Yang

Jiang²,

Mao³

et al. 2022

5th Optics Young Scientist Summit (OYSS 2022)

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As the hardest substance known in nature, diamond has plenty of excellent characteristics of good chemical stability, high thermal conductivity and high transmittance. Due to its unique physicochemical properties, diamond has shown great application value and prospects in the fields of solid-state power electronics, solid wave gyroscope, quantum communication, and high-precision tools, which make a strict request for the surface quality of diamonds. To this end, people have developed ultra-precision machining methods such as mechanical polishing, chemical mechanical polishing, laser polishing, and ultraviolet-irradiated precision polishing. However, owing to the unique lattice structure and ultra-high hardness of diamond, it is difficult to polish its surface roughness less than one nanometer by conventional methods . Therefore, modificating the physical and chemical properties of the diamond surface through the interaction of light and matter is an extremely promising method to reduce the processing difficulty and improve the fabrication accuracy. In recent years, with the continuous development of light source quality, laser polishing and ultraviolet catalytic polishing based on the interaction between light and diamond have received widespread attention. Laser polishing mainly takes advantage of the diamond graphitization under high-power laser irradiation to achieve the removal of diamond surface materials. While ultraviolet-irradiated precision polishing is based on the theory that ultraviolet light sources with the photon energy greater than bandwidth of diamond can induce photochemical reactions on the diamond surface to achieve diamond surface polishing. This paper introduces the main research progress in the field of diamond laser polishing and ultraviolet-irradiated precision polishing and compares the basic principles and processing devices of these two processing methods. Through the discussion of above problems, the characteristics of two processing methods are summarized, and the consideration on the optimization of diamond ultra-precision polishing methods is proposed accordingly, to further improve the processing accuracy of diamond ultra-precision polishing.

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Section: Progress Of Laser Polishingmentioning

confidence: 99%

Progress in diamond polishing with light source assistance

Yang

Jiang²,

Mao³

et al. 2022

5th Optics Young Scientist Summit (OYSS 2022)

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“…Other methods of milling and pattering diamond exist 3-5 but tend to be slower than laser ablation, which is important if significant thickness reduction or large aspect ratios are required. Previous studies of laser ablation of diamond [6][7][8][9][10] were typically conducted with excimer lasers having nanosecond pulse durations. We have investigated laser ablation of both singleand polycrystalline CVD diamond using laser pulses of picosecond and nanosecond durations and wavelengths of 213, 266, 532, and 1064 nm.…”

Section: Introductionmentioning

confidence: 99%

Laser patterning of diamond. Part I. Characterization of surface morphology

Smedley

Bohon

et al. 2009

Journal of Applied Physics

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As the use of diamond as a material for electronic and research applications increases, methods of patterning diamond will be required. In this work, single-and polycrystalline synthetic diamond samples were exposed to laser beams of different energies, wavelengths, and pulse durations. The effects of this exposure were characterized using optical microscopy, scanning electron microscopy, and atomic force microscopy. The threshold ablation energy density for 266 nm radiation with ϳ30 ps pulse duration was measured to be ϳ14 J / cm 2 . The threshold for ϳ10 ns pulses at the same wavelength was similar, but the ablated area displayed larger surface damage. The surface damage and the threshold energy increase significantly for 532 and 1064 nm radiations. Ablation performed using 213 nm radiation produced the most uniform surface. Changes in the ablated surface are presented in detail.

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“…Only the excimer laser polishing treatment can achieve very smooth surfaces. Gloor et al [1] used an ArF excimer laser to polish diamond films. Cappelli et al [2] irradiated thin diamond films with a pulsed ArF laser at a near-grazing incidence.…”

Section: Introductionmentioning

confidence: 99%

Machining a smooth surface of ceramic material by laser fracture machining technique

Tsai

2004

Journal of Materials Processing Technology

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Laser ablation of diamond films in various atmospheres

Cited by 29 publications

References 5 publications

Progress in diamond polishing with light source assistance

Progress in diamond polishing with light source assistance

Laser patterning of diamond. Part I. Characterization of surface morphology

Machining a smooth surface of ceramic material by laser fracture machining technique

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