Large Scale 3D Topology Optimization of Conjugate Heat Transfer

Sun, Sicheng; Liebersbach, Piotr; Qian, Xiaoping

doi:10.1109/itherm.2019.8757230

Cited by 8 publications

(2 citation statements)

References 1 publication

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“…Regarding the optimizer, both gradient-based and non-gradient-based approaches can be employed. The gradient method calculates the objective function's gradient and its stagnant point, often using the adjoint method [140]. Currently, a combination of the density-based method, FEM, and gradient-based optimizer represents the mainstream approach for TO of heat sinks/heat exchangers [4].…”

Section: Topology Optimization (To) Of Global Flow Configurationmentioning

confidence: 99%

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Li,

Roux,

Castelain

et al. 2023

Energies

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This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems. Special focus is given to the design and structural optimization of heat sinks for efficient single-phase liquid cooling. Firstly, the paper highlights the common presence and detrimental consequences of electronics overheating resulting from multiple heat sources, supported by various illustrative examples. Subsequently, the emphasis is placed on single-phase liquid cooling as one of the effective thermal management technologies for power electronics, as well as on the enhancement of heat transfer in micro/mini channel heat sinks. Various studies on the design and structural optimization of heat sinks are then analyzed and categorized into five main areas: (1) optimization of channel cross-section shape, (2) optimization of channel flow passage, (3) flow distribution optimization for parallel straight channel heat sinks, (4) optimization of pin-fin shape and arrangement, and (5) topology optimization of global flow configuration. After presenting a broad and complete overview of the state of the art, the paper concludes with a critical analysis of the methods and results from the literature and highlights the research perspectives and challenges in the field. It is shown that the issue of uneven and overheating caused by multiple heat sources, which is commonly observed in modern electronics, has received less attention in the literature compared to uniform or single-peak heating. While several design and structural optimization techniques have been implemented to enhance the cooling performance of heat sinks, topology optimization has experienced significant advancements in recent years and appears to be the most promising technology due to its highest degree of freedom to treat the uneven heating problem. This paper can serve as an essential reference contributing to the development of liquid-cooling heat sinks for efficient thermal management of electronics.

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Section: Topology Optimization (To) Of Global Flow Configurationmentioning

confidence: 99%

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Li,

Roux,

Castelain

et al. 2023

Energies

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“…The topology optimization of such heat sinks to achieve low-volume high-power density modules is an active area of interest. One category of heat sink design optimization involves gradient/Hessian-based methods [4]- [6]. Another category is based on the use of population-based evolutionary algorithms [7]- [9].…”

mentioning

confidence: 99%

Heat Sink Design for WBG Power Modules Based on Fourier Series and Evolutionary Multi-Objective Multi-Physics Optimization

Gurpinar¹,

Sahu²,

Ozpineci³

2021

IEEE Open J. Power Electron.

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Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation. This study proposes a design optimization method for liquid-cooled heat sinks that use a Fourier analysis-based tool and an evolutionary optimization algorithm to optimize the heat sink geometry for specified objectives. The optimized heat sink geometry was compared with state-of-the-art solutions in the literature based on finite element analysis of different designs. The proposed methodology can develop complex geometries that outperform conventional heat sink geometries. Optimized heat sink design from the proposed method was fabricated and tested in an experimental setup under representative operating conditions. The experimental setup was also modeled in the finite element model that was used for the proposed heat sink optimization method. The experimental results show that developed finite element models can predict the thermal and flow performance of the complex design with high fidelity, and the results validate the proposed design approach.

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3D topology optimisation of liquid-cooled microchannel heat sinks

Marshall

Lee

2022

Thermal Science and Engineering Progress

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Large Scale 3D Topology Optimization of Conjugate Heat Transfer

Cited by 8 publications

References 1 publication

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Heat Sink Design for WBG Power Modules Based on Fourier Series and Evolutionary Multi-Objective Multi-Physics Optimization

3D topology optimisation of liquid-cooled microchannel heat sinks

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