Large format resistive array (LFRA) infrared scene projector (IRSP) performance and production status

Oleson, Jim; James, Jay; LaVeigne, Joe; Sparkman, Kevin; Matis, Greg; McHugh, Steve; Lannon, John; Goodwin, Scott; Huffman, Alan; Solomon, Steve; Bryant, Patrick

doi:10.1117/12.669301

Cited by 8 publications

(6 citation statements)

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“…Resistive arrays are one of the more ubiquitous technologies used in IRSPs [1,2]. Such systems control the current flowing through individual resistor pixel elements to heat them to a desired temperature in order to generate an infrared scene.…”

Section: Resistive Arraysmentioning

confidence: 99%

Thermal resolution specification in infrared scene projectors

2015

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Infrared scene projectors (IRSPs) are a key part of performing dynamic testing of infrared (IR) imaging systems. Two important properties of an IRSP system are apparent temperature and thermal resolution. Infrared scene projector technology continues to progress, with several systems capable of producing high apparent temperatures currently available or under development. These systems use different emitter pixel technologies, including resistive arrays, digital micro-mirror devices (DMDs), liquid crystals and LEDs to produce dynamic infrared scenes. A common theme amongst these systems is the specification of the bit depth of the read-in integrated circuit (RIIC) or projector engine, as opposed to specifying the desired thermal resolution as a function of radiance (or apparent temperature). For IRSPs, producing an accurate simulation of a realistic scene or scenario may require simulating radiance values that range over multiple orders of magnitude. Under these conditions, the necessary resolution or "step size" at low temperature values may be much smaller than what is acceptable at very high temperature values. A single bit depth value specified at the RIIC, especially when combined with variable transfer functions between commanded input and radiance output, may not offer the best representation of a customer's desired radiance resolution. In this paper, we discuss some of the various factors that affect thermal resolution of a scene projector system, and propose some specification guidelines regarding thermal resolution to help better define the real needs of an IR scene projector system.

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Section: Resistive Arraysmentioning

confidence: 99%

Thermal resolution specification in infrared scene projectors

2015

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“…1 Desired higher maximum pixel temperatures 2 are challenged by materials issues such as oxidation of resistive elements, diffusion of impurities into dielectrics with resulting shorts, and strains due to recrystallization. To allow investigation of novel high-temperature materials without the cost of full finished-array manufacturing runs, we have designed and fabricated simplified pixels for testing.…”

Section: Introductionmentioning

confidence: 99%

Test pixels for high-temperature infrared scene projection

Fredricksen¹,

Calhoun

Trewick

et al. 2015

SPIE Proceedings

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High pixel temperatures for IR scene projector arrays face materials challenges of oxidation, diffusion, and recrystallization. For cost effective development of new high-temperature materials, we have designed and fabricated simplified pixels for testing. These consist of resistive elements, traces, and bond pads sandwiched between dielectric layers on Si wafers. Processing involves a pad exposure etch, a pixel outline etch, and an undercut etch to thermally isolate the resistive element from the substrate. Test pixels were successfully fabricated by electron-beam lithography using a combination of wet and dry etching.

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“…The Ultra High Temperature (UHT) [1] Infrared Scene Projector (IRSP) program is developing new pixels that can reach the high apparent temperature needs of today's test applications. The technology used to produce the emitter array as well as the drive electronics were leveraged from the existing MIRAGE XL [2] and OASIS 1024 [3] Infrared Scene Projection Systems. These new materials and pixels were developed with RTI International under the Ultra High Temperature program.…”

Section: Introductionmentioning

confidence: 99%

Ultrahigh-temperature emitter pixel development for scene projectors

et al. 2014

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To meet the needs of high fidelity infrared sensors, under the Ultra High Temperature (UHT) development program, Santa Barbara Infrared Inc. (SBIR) has developed new infrared emitter materials capable of achieving extremely high temperatures. The current state of the art arrays based on the MIRAGE-XL generation of scene projectors is capable of producing imagery with mid-wave infrared (MWIR) apparent temperatures up to 700K with response times of 5 ms. The Test Resource Management Center (TRMC) Test and Evaluation/Science & Technology (T&E/S&T) Program through the U.S. Army Program Executive Office for Simulation, Training and Instrumentations (PEO STRI) has contracted with SBIR and its partners to develop a new resistive array based on these new materials, using a high current Read-In Integrated Circuit (RIIC) capable of achieving higher temperatures as well as faster frame rates. The status of that development will be detailed within this paper, including performance data from prototype pixels.

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Large format resistive array (LFRA) infrared scene projector (IRSP) performance and production status

Cited by 8 publications

References 0 publications

Thermal resolution specification in infrared scene projectors

Thermal resolution specification in infrared scene projectors

Test pixels for high-temperature infrared scene projection

Ultrahigh-temperature emitter pixel development for scene projectors

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