Abstract:In this article we present a new large aperture 1D-MEMS scanner module especially designed for laser radar systems. The scanner module has a resonance frequency of 250 Hz and optical scan range of 60°. It comprises of two separate scanning channels: (a) a single scanning mirror of the collimated transmitted beam oscillates parallel to (b) a scanning mirror array of the receiver optics. The receiver optics use a synchronized array of 2 x 7 identical mirror elements, each with 2.51x 9.51 mm² per single mirror el… Show more
“…and scan rates of 21 kHz [2,10]. However, a resonant mirror's maximum beam diameter is only increased at the expense of decreasing the maximum scan rate [9].…”
“…and scan rates of 21 kHz [2,10]. However, a resonant mirror's maximum beam diameter is only increased at the expense of decreasing the maximum scan rate [9].…”
“…In some application fields, in contrast, the MEMS structure is becoming larger owing to its application requirements. Laser scanner [4][5][6] and energy harvesting devices 7,8) are typical applications that require large MEMS fabrication.…”
Section: Large Mems Structuresmentioning
confidence: 99%
“…In this example, the resist almost disappeared after 123 cycles, probably owing to the smaller heat exchange. Then only SF 6 isotropic etching was performed with 300 sccm SF 6 , a coil power of 1800 W, and a bias power of 50 W. The SF 6 isotropic etching was stopped every 4 min and the chip was optically observed. Figure 14 shows photographs of the progress of the isotropic etching.…”
Section: Towards Higher Reliability: All-dry Uniform Backside Etchingmentioning
We propose a compensated mesh pattern filling method to achieve highly uniform wafer depth etching (over hundreds of microns) with a large-area opening (over centimeter). The mesh opening diameter is gradually changed between the center and the edge of a large etching area. Using such a design, the etching depth distribution depending on sidewall distance (known as the local loading effect) inversely compensates for the overcentimeter-scale etching depth distribution, known as the global or within-die(chip)-scale loading effect. Only a single DRIE with test structure patterns provides a micro-electromechanical systems (MEMS) designer with the etched depth dependence on the mesh opening size as well as on the distance from the chip edge, and the designer only has to set the opening size so as to obtain a uniform etching depth over the entire chip. This method is useful when process optimization cannot be performed, such as in the cases of using standard conditions for a foundry service and of short turn-around-time prototyping. To demonstrate, a large MEMS mirror that needed over 1 cm 2 of backside etching was successfully fabricated using as-is-provided DRIE conditions.
“…2,10 However, a resonant mirror's maximum beam diameter is only increased at the expense of decreasing the maximum scan rate. 9 An optical amplification of the steering angle by an inverse telescope design has been reported; however, this design requires a reduced beam diameter to conserve the Lagrange invariant, which would limit the effective delivery of light over large distances due to beam spreading by diffraction.…”
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.