Abstract:Post semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) manufacturing are now capable of producing trace widths of a few micrometers, high aspect ratio vias, three-dimensional constructions, and highly integrated systems in a single small package. Such PSM technology can in principle be used to manufacture micro electromechanical systems (MEMS) for sensing and actuation applications. Although MEMS are traditionally produced using silicon processes, the broad array … Show more
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