Ladder-structured boron nitride nanosheet skeleton in flexible polymer films for superior thermal conductivity

Huang, Taoqing; Yang, Fubao; Wang, Jun; Li, Yongwei; Huang, Jiping; Chen, Min; Wu, Limin

doi:10.1016/j.apmt.2021.101299

Cited by 20 publications

(21 citation statements)

References 35 publications

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“…The electrically conductive properties of most carbon-based materials hinder their thermal management applications in the field of electronic insulation. Thus far, the thermally conductive and insulating fillers that have been mainly studied and applied are boron nitride (BN), [14][15][16][17][18][19] alumina (Al 2 O 3 ), 20,21 and nanodiamond (ND). [22][23][24] The intrinsic thermal conductivity of hexagonal boron nitride (h-BN) and Al 2 O 3 are insufficient, while the application of boron nitride nanosheets (BNNSs) with their high thermal conductivity is problematic because of their high cost and resultant agglomeration.…”

Section: Introductionmentioning

confidence: 99%

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

Gong

et al. 2022

J. Mater. Chem. C

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Section: Introductionmentioning

confidence: 99%

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

Gong

et al. 2022

J. Mater. Chem. C

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“…Commonly used thermally conductive fillers include carbon-based fillers (carbon nanotubes, 30,31 carbon fibers, 32 silicon carbide, 33 and graphene, 34,35 etc. ), ceramic fillers (boron nitride, 27,[36][37][38] aluminum nitride, 39 silicon nitride, 40 aluminum oxide, [41][42][43] and magnesium oxide, 44 etc.) and metal fillers (aluminum, 45 copper, 46 and silver, 47 etc.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

Liu

et al. 2022

J of Applied Polymer Sci

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Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, highthermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm 2 /s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.

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“…[ 16 ] Wu et.al presented an ice‐press assembly strategy to prepare a ladder‐structured h‐BNNS skeleton structural polymer composite film, which exhibitions high thermal conductivity of 11.2 Wm −1 ·K −1 , excellent flexibility, and inherent electrical insulation. [ 17 ] Thus, BN nano‐filler shows a distinctive capacity in the field of thermal management dielectric materials. [ 18–20 ]…”

Section: Introductionmentioning

confidence: 99%

In situ synthesis of boron nitride “nanonoodles” based epoxy nanocomposites with enhanced thermal and dielectric properties

Miao

Wang

et al. 2022

Polymer Composites

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The development of low loading fraction nanoscale reinforcements that can be used to improve the dielectric and thermal properties of a polymer remains a challenge by the reason of the insurmountable difficulties with exfoliation and dispersion of polymer nanocomposites. Here, we combined noodle‐like boron nitride nanoribbons (BNNRs) with epoxy resin (EP) by a facile in situ synthesis. The hydroxyl and amino on the BNNRs surface can not only improve dispersibility but also conduct the formation of EP with BNNRs by the in situ ring‐opening reaction. The thermal behavior, dielectric properties, and thermal conductivity of BNNRs/EP nanocomposites with different BNNRs contents were investigated. At an extremely low BNNRs loading fraction of 1 wt%, the thermal conductivity of the nanocomposite increased 48%, which is attributed to the long continuous heat conduction path formed by the strong integration of BNNRs and EP. In addition, the electrical breakdown strength increased from 95.58 to 159.17 kV·mm−1 as the BNNRs content increased, while the nanocomposites maintained acceptable dielectric properties. The results indicate the potential for BNNRs as a new class of nanofiller for dielectric polymers.

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Ladder-structured boron nitride nanosheet skeleton in flexible polymer films for superior thermal conductivity

Cited by 20 publications

References 35 publications

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

Highly flexible cellulose nanofiber/single-crystal nanodiamond flake heat spreader films for heat dissipation

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

In situ synthesis of boron nitride “nanonoodles” based epoxy nanocomposites with enhanced thermal and dielectric properties

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