2006
DOI: 10.4028/www.scientific.net/kem.317-318.85
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Kumada Rearrangement of Polydimethylsilane Using a Catalytic Process

Abstract: Polycarbosilane was synthesized from polydimethylsilane in the presence of ZSM-5 (Si/Al=30) as a catalyst at 350oC-400oC. Characterization of synthesized polycarbosilane was performed with 29Si Solid NMR, FT-IR, and GPC analysis. Number average of molecular weight (Mn) of the polycarbosilane was ranged from 350 to 2340.

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Cited by 7 publications
(6 citation statements)
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“…It is closely related to molecular structure of PCS. Model of the molecular structure of PCS which was reported by Hasegawa et al 2 and Kim et al 14 indicates that molecular PCS composes SiC 4 bond structure in the backbone and methyl and hydrogen bond in the pendent which act as a cross-linking site with oxygen during thermal oxidation curing 3,14 . Low M w PCS (PCS_1) has high SiC 3 H bond whereas high M w PCS (PCS_2) has high SiC 4 bond portion.…”
Section: Resultsmentioning
confidence: 97%
“…It is closely related to molecular structure of PCS. Model of the molecular structure of PCS which was reported by Hasegawa et al 2 and Kim et al 14 indicates that molecular PCS composes SiC 4 bond structure in the backbone and methyl and hydrogen bond in the pendent which act as a cross-linking site with oxygen during thermal oxidation curing 3,14 . Low M w PCS (PCS_1) has high SiC 3 H bond whereas high M w PCS (PCS_2) has high SiC 4 bond portion.…”
Section: Resultsmentioning
confidence: 97%
“…The peaks between −50 and −30 ppm are attributed to Si–Si units of linear polysilane backbone (–SiMe 2 –SiMe 2 –, –SiMe 2 –HSiMe–, etc.) according to the literature 48, 60, 64. The broad peaks at −5 ∼ 5 ppm and −20 ∼ −5 ppm are assigned to SiC 4 and HSiC 3 groups, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…The reaction mechanism of PCS synthesized from PDMS by thermal decomposition is referred to as the well-known Kumada rearrangement. 11,48,58 According to this mechanism, silicon free radical is formed first when Si-Si bond is cleaved by heating, followed by rearrangement involving insertion of methylene group in Si-Si chain to give Si-CH 2 -Si and Si-H groups (Scheme 1). 11,59 Therefore, it is very important to control the dissociation of Si-Si chain in the first step.…”
Section: Pcs Prepared At 4708cmentioning
confidence: 99%
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