Ku-Band MMIC LNA Design for Space Applications

Arican, Galip Orkun; Akcam, Nursel; Yazgan, Erdem

doi:10.1109/iceee2019.2019.00059

Cited by 14 publications

(8 citation statements)

References 5 publications

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“…7 In other words, higher source inductance improves the stability of the transistor while gain decreases. 8 Moreover, the source inductance is determined by the transconductance Equation 2.…”

Section: Mmic Lna Designmentioning

confidence: 99%

“…The transition plays a key role in transferring the received signal from TE 10 mode to microstrip line Quasi-TEM mode with minimum loss. 8 In the design, the single-ridged topology was utilized to have a broadband matching and be compatible with the hermetic module. Moreover, CST simulator was utilized to design and simulate the transition circuit.…”

Section: Wr75 Waveguide Transitionmentioning

confidence: 99%

“…However, there is tradeoff between the transconductance, stabilization, and NF performances 7 . In other words, higher source inductance improves the stability of the transistor while gain decreases 8 . Moreover, the source inductance is determined by the transconductance Equation ).

g_{m}^{'} = \frac{g_{normalm}}{1 + italicjω L_{s} ((), g_{m} + italicjω C_{gs})},

where “ g m ” is the transconductance, “ L s ” is the source inductance, and “ C gs ” is the gate to source capacitance.…”

Section: Rf Front‐end Module Designmentioning

confidence: 99%

“…Waveguide to microstrip transition is an inevitable component between the antenna and receiver. The transition plays a key role in transferring the received signal from TE 10 mode to microstrip line Quasi‐TEM mode with minimum loss 8 . In the design, the single‐ridged topology was utilized to have a broadband matching and be compatible with the hermetic module.…”

Section: Rf Front‐end Module Designmentioning

confidence: 99%

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Ku‐band GaAs mHEMT MMIC and RF front‐end module for space applications

Yazgan

Arican

Akcam

2020

Micro & Optical Tech Letters

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This article presents a Ku‐band Low Noise Amplifier (LNA) Monolithic Microwave Integrated Circuit (MMIC) and RF front‐end module for space applications. LNA MMIC was developed with utilizing 0.07 μm GaAs m‐HEMT process. Noise Figure (NF) and gain results of LNA module were measured as 1.3 and 43 dB, respectively and OIP3 was measured as +20 dBm at the ambient temperature. The LNA module was tested in the temperature range between −25°C and 75°C and small signal gain and NF variation were less than 3 and 0.8 dB, respectively. This article describes the MMIC LNA design, mechanical chassis design, WR75 waveguide‐to‐microstrip design, and measurement results of the LNA front‐end module.

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Section: Mmic Lna Designmentioning

confidence: 99%

Section: Wr75 Waveguide Transitionmentioning

confidence: 99%

g_{m}^{'} = \frac{g_{normalm}}{1 + italicjω L_{s} ((), g_{m} + italicjω C_{gs})},

where “ g m ” is the transconductance, “ L s ” is the source inductance, and “ C gs ” is the gate to source capacitance.…”

Section: Rf Front‐end Module Designmentioning

confidence: 99%

Section: Rf Front‐end Module Designmentioning

confidence: 99%

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Ku‐band GaAs mHEMT MMIC and RF front‐end module for space applications

Yazgan

Arican

Akcam

2020

Micro & Optical Tech Letters

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“…The switch is modeled in the high frequency structure simulator (HFSS). When thrown to on-state, the diode can be equivalent to a resistance, and the bypass diode can be equivalent to a ground inductance to filter out lowfrequency components [12]. In order to ensure the isolation degree of the two branches, the circuit board is designed by punching.…”

Section: Design Of Transceiver Switchmentioning

confidence: 99%

A transceiver frequency conversion module based on 3D micropackaging technology

Liu

Wang

et al. 2020

J. of Syst. Eng. Electron.

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The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology, the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits (MMIC) operating chip, the 3D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board (PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.

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