2019
DOI: 10.1049/el.2018.7179
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Ku‐ and K‐band high‐efficiency GaN MMIC HPA chipset for satellite communications

Abstract: A GaN monolithic microwave-integrated circuit (MMIC) driver and high power amplifier (HPA) chipset solution are presented for two commonly utilised satellite communications frequency bands. The MMICs represent first pass designs utilising Qorvo's recently released 0.15 µm GaN on SiC process featuring slot via devices.

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Cited by 11 publications
(3 citation statements)
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“…The satellite-based communication system, characterized by satellite-ground interaction, is extensively used, not only in satellite communication per se, but also in remote-sensing measurements, and various other fields [6]. The Ku-Band, known for its extended signal-transmission range and robust anti-interference capability, is widely employed in satellite-based communications [7][8][9][10][11]. The power amplifier (PA), a critical component in the satellite-based communication system, is primarily employed for amplifying and transmitting high-power RF signals.…”
Section: Introductionmentioning
confidence: 99%
“…The satellite-based communication system, characterized by satellite-ground interaction, is extensively used, not only in satellite communication per se, but also in remote-sensing measurements, and various other fields [6]. The Ku-Band, known for its extended signal-transmission range and robust anti-interference capability, is widely employed in satellite-based communications [7][8][9][10][11]. The power amplifier (PA), a critical component in the satellite-based communication system, is primarily employed for amplifying and transmitting high-power RF signals.…”
Section: Introductionmentioning
confidence: 99%
“…Indeed, aspects such as lower cost, graceful degradation, form factor, etc., can introduce significant benefits at satellite level. In this context, several monolithic microwave integrated circuits (MMICs) PAs have been recently demonstrated up to K/Q band [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23].…”
Section: Introductionmentioning
confidence: 99%
“…Higher critical electric fields in these materials enable thinner, more highly doped voltageblocking layers, which can reduce on-resistance by up to two orders of magnitude in majority carrier devices compared to Si. The two most developed wide bandgap semiconductors are SiC [4][5][6][7][8] and GaN, [9][10][11][12][13][14][15] with SiC now commercialized for many applications in power management and GaN being used in X-/Ku-band RF power devices and monolithic microwave integrated circuits (MMICs). Even higher power figures-of-merit are theoretically possible with BN, diamond, high-Al AlGaN and Ga 2 O 3 .…”
mentioning
confidence: 99%