“…However, there are limited data on Ar incorporation in InP as compared to Si 10,11 and GaAs. 12,13 Previous published work has focused on the effect of low-energy Ar ϩ bombardment on the surface stoichiometry of InP. 9,14-26 A summary of recently published data of sputtered InP samples have shown the surface region to be either In rich or stoichiometric.…”
“…However, there are limited data on Ar incorporation in InP as compared to Si 10,11 and GaAs. 12,13 Previous published work has focused on the effect of low-energy Ar ϩ bombardment on the surface stoichiometry of InP. 9,14-26 A summary of recently published data of sputtered InP samples have shown the surface region to be either In rich or stoichiometric.…”
“…The deposited layers have to perform at temperatures of 800 -900 0 e and for that reason the high temperature behaviour of the deposited layers has to be studied. From literature [48][49][50][51][52][53] it is known that during a post deposition treatment a number of changes may occur e.g. recrystallization, outgassing, stress relaxation etc.…”
Experimental Apparatus and procedure Deposition of copper layers Copper deposition by ion plating Characterization of ion plated copper layers Copper deposition by evaporation at high substrate temperatures Characterization of evaporated copper layers Copper deposition by D.C. bias sputtering Characterization of D.C. bias sputtered copper layers Copper deposition by D.C. sputtering Characterization of D.C. sputtered copper layers Silver deposition by D.C. sputtering Characterization of D.C. sputtered silver layers Discussion Conclusions References chapter 4 Solid state carburization experiments on copper and silver 106
“…The deposited layers have to perform at temperatures of 800 -900 0 e and for that reason the high temperature behaviour of the deposited layers has to be studied. From literature [48][49][50][51][52][53] it is known that during a post deposition treatment a number of changes may occur e.g. recrystallization, outgassing, stress relaxation etc.…”
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