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Esparducer, A.; Fernández, Miguel Ángel Luque; Segarra, M.; Chimenos, J.M.; Espiell, F.; García, Marta E.; Guixà, O.

doi:10.1023/a:1004650702555

Cited by 6 publications

(2 citation statements)

References 2 publications

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“…After refining, casting and hot rolling, the product obtained is fire-refined high conductivity (FRHC) copper rods. The mechanical and electrical properties of the copper rod obtained in this way are similar to the cathode-based electrolytic ones [1]. FRHC copper contains trace amounts of impurities, some of which are known to play an important rô le in the solidification process.…”

mentioning

confidence: 64%

Effect of Pb in FRHC copper: phase diagram and solidification studies

Touron

Comas

Clavaguera-Mora

et al. 2001

Scand Jof Metallurgy

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mentioning

confidence: 64%

Effect of Pb in FRHC copper: phase diagram and solidification studies

Touron

Comas

Clavaguera-Mora

et al. 2001

Scand Jof Metallurgy

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“…An alternative approach to the preparation of biaxially textured buffered layer substrates is electrodeposition [13]. This method is one of the simpler and cheaper processes available for the fabrication of thin metal films.…”

Section: Introductionmentioning

confidence: 99%

Preparation of biaxially cube textured Ag, Cu-Au and Cu-Au-Ag films on Cu substrates for HTS coated conductor applications

Díaz

Segarra

Espiell

et al. 2001

Supercond. Sci. Technol.

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Copper (100) cube textured tapes have been covered successfully with biaxially textured thin and thick films of silver, gold and gold-silver by electrodeposition techniques for high temperature superconductors (HTS) coated conductor applications. The cube texture of Cu was promoted by recrystallization after smooth cold rolling. The biaxially cube textured Ag films were obtained by the electro-epitaxial deposition technique using no post-deposition heat treatment. Intermediate gold buffer layers were prepared in order to increase the thermal stability of the cube-textured Ag-buffered Cu substrates. The as-electrodeposited Au buffer layers were polycrystalline, but after an annealing treatment at high temperature the Au is absorbed by diffusion mechanism into the Cu tapes and a biaxially solid solution of Au-Cu(100) is formed on the surface. Ag thin films deposited on Cu-Au substrates form the same biaxial cube texture as the rolled Cu tapes after recrystallization at high temperature.

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