1995
DOI: 10.1021/ie00043a049
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Kinetics of the dissolution of copper in iron(III) chloride solutions

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Cited by 24 publications
(21 citation statements)
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References 8 publications
(16 reference statements)
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“…Various techniques are employed for the generation of nanosized material from its bulk one [1][2][3][4][5][6][7][8][9][10]. Generally, thermal treatments are employed for this purpose, unfortunately it requires costly instruments.…”
mentioning
confidence: 99%
“…Various techniques are employed for the generation of nanosized material from its bulk one [1][2][3][4][5][6][7][8][9][10]. Generally, thermal treatments are employed for this purpose, unfortunately it requires costly instruments.…”
mentioning
confidence: 99%
“…At a higher dose rate condition, the graphene decomposed more quickly, and the exposed copper reacted with iron (III) chloride solution within a few tens of seconds. The dissolution reaction of the copper nanoparticles in the iron (III) chloride solution was very difficult to observe because of the fast dissolution rate of 0.04 mg/cm 2 s (Bryce & Berk, 1995). This rate is fast enough for nano-sized particles to dissolve in few seconds.…”
Section: Resultsmentioning
confidence: 99%
“…Besides recovery of noble metals by OAR from waste electronic products/processing, etching of metals by OAR may find an important application in subtractive patterning of copper (Cu) connection/conduction paths in electronic packaging. Various Cu etching processes have been developed for the fabrication of printed circuit board, and Cu/low-K interconnects associated with back-end-of-line (Bryce & Berk, 1995;Cakir, 2006;Cakir et al, 2005;Halpern, 1953). However, the etching rates are still not satisfactory (Table 4); etchants of higher etching rates are desired.…”
Section: Fast Etching Of Copper For Applications In Electronic Industrymentioning
confidence: 99%