Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures

Morphology of Compounds Formed by Isothermal Reactive Diffusion between Solid Fe and Liquid Al

“…If boundary diffusion contributes to the layer growth and grain growth takes place in the compound layer, however, n becomes smaller than 0.5 and gradually varies depending on t. Under such conditions, l is no longer expressed as a power function of t in a wide range of t. In a rather narrow range of t, however, n is approximately considered as constant independent of t within experimental uncertainty. [38][39][40] According to the result in Fig. 9, n is smaller than 0.5 at T ¼ 973{1073 K. Thus, we may expect that the growth of the intermetallic layer is controlled by boundary and volume diffusion.…”

“…For instance, the reactive diffusion between Au and Sn was experimentally examined at solid-state temperatures in previous studies. [37][38][39][40] In these experiments, Au/Sn diffusion couples were prepared by a diffusion bonding technique, and then isothermally annealed in the temperature range of 393-473 K. In this temperature range, AuSn 4 , AuSn 2 , AuSn, Au 5 Sn and are the stable compounds in the binary Au-Sn system. 1) After annealing, however, AuSn 4 , AuSn 2 and AuSn layers were discerned at the Au/Sn interface in the diffusion couple, but Au 5 Sn and were not observed clearly.…”

Reactive Diffusion between Ag and Sn at Solid State Temperatures

“…[13][14][15] The Sn/Ag/Sn couples were completely dried and then heat treated for diffusion bonding in the oil bath for 72 h at T ¼ 433, 453 and 473 K. The diffusion couples were annealed at the same temperatures for various periods up to 1028 h. The summation of the heat-treating and annealing times is hereafter merely called the annealing time. Crosssections of the annealed diffusion couples were mechanically polished using diamond with diameters of 15, 3 and 1 mm, and then finished utilizing an OP-S liquid by Struers Ltd.…”

“…[13][14][15] The diffusion couples were isothermally annealed at temperatures between T ¼ 393 and 473 K for various periods in an oil bath with silicone oil. Here, T is the annealing temperature.…”

“…Sn/ Ag/Sn diffusion couples were prepared by the diffusion bonding technique and then isothermally annealed at T ¼ 433{473 K in the oil bath in a similar manner to previous studies. [13][14][15] The growth behavior of Ag-Sn compound layers was metallographically observed, and then the rate-controlling process of the reactive diffusion was discussed.…”