2000
DOI: 10.1016/s1359-6454(99)00379-1
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Kinetics of phase formation in binary thin films: the Ni/Al case

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Cited by 23 publications
(10 citation statements)
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“…where d represents the diffusion depth, D is interdiffusion coefficient of Al/Ni couple (D = 8 × 10 −18 m 2 s −1 at 600 • C [31]) and t is the diffusion time. When the intermediate such as Ni 2 Al 3 appears, D increases to the value of 1 × 10 −14 m 2 s −1 at 600 • C [32].…”
Section: Effect Of Sintering Temperature On the Microstructure And Swmentioning
confidence: 99%
“…where d represents the diffusion depth, D is interdiffusion coefficient of Al/Ni couple (D = 8 × 10 −18 m 2 s −1 at 600 • C [31]) and t is the diffusion time. When the intermediate such as Ni 2 Al 3 appears, D increases to the value of 1 × 10 −14 m 2 s −1 at 600 • C [32].…”
Section: Effect Of Sintering Temperature On the Microstructure And Swmentioning
confidence: 99%
“…This change of growth rate constant could be attributed to the formation of a continuous Al 3 Ni layer. After the formation of Al 3 Ni phase, the growth of overall coating is controlled by the growth of the former phase, because the growth of Al 3 Ni layer is very much slower than Al 3 Ni 2 layer [15].…”
Section: Introductionmentioning
confidence: 99%
“…The stability condition and convergence criterion for the finite difference solution is given by (e.g. [45,46] ) maxðD n i ÞDt ðDxÞ 2 1 2 . For all cases that were considered in the present paper this parameter was < 0.02.…”
Section: Numerical Solution For Composition Profilesmentioning
confidence: 99%
“…They proposed that their iterative method takes less calculation time than other procedures. Garcia et al [45] studied a finite difference scheme to solve the one-dimensional Diffusion Equation with special focus on the stability and convergence of the scheme. They outlined the better numerical methodology and its applicability for a metal-metal system.…”
Section: Introductionmentioning
confidence: 99%