Kinetics of Metal Deposition

Abstract

The discharge characteristics of the deposition of lead, thallium, silver, bismuth, copper, tin, and antimony ions onto the solid metals, using constant current voltammetry, are reported and discussed.At least two parameters are needed to describe deposition onto solid surfaces that are not required when working with mercury electrodes. These are (a) a roughening factor, f, which may be defined as the ratio to the geometrical area of the surface area effective for the transport of discharging molecules, and (b) a reactivity factor, 8, which is the ratio to the geometrical area of the area reactive to the discharge process.A direct comparison of kinetic data for solid metal deposition obtained by different methods is not valid unless these measurements are made while the metals are being continuously deposited at comparable current densities and from identical solutions.