Kinetics of current-enhanced dissolution of nickel in liquid aluminum

Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

“…It suggests that the contribution of electromigration is not expected to be significant to decrease the solid-liquid interfacial tension. As has been reported before, Lorentz force caused by the interaction between the applied DC and its own induced magnetic field gives rise to significant convection in liquid phase [23]. In our case, flow field in the drop, which is similar to that reported in [27], provides a driving force for composition homogenization and weakens composition fluctuation at the solid-liquid interface due to electromigration.…”

“…It suggests that DC reduces the diffusion activation energy of solute and then increases its diffusion coefficient ( ) at the same temperature in terms of the relationship between , , and absolute temperature ( ) [22]. Similarly, Zhao and coworkers have found that the calculated diffusion coefficient for solid Ni in liquid Al increases with increasing current density under DC and approaches a relatively stable value at a certain critical current density, regardless of current polarity [23]. It is concluded that DC plays an important role in promoting the diffusion process of metal atoms.…”

Directional electromigration-enhanced interdiffususion in the Cu–Ni system

“…More recent research on metal-metal interactions under the influence of a current has shown significant enhancement of the growth rate of the intermetallic phases resulting from such interactions. [3][4][5][6][7] However, the effect of the magnitude of the dc and its direction on interdiffusion could not be unambiguously separated from its influence on the nucleation and growth of the resulting intermetallics. To avoid this complication, we have chosen for this investigation the copper-nickel system in which only solid solutions form.…”

“…1,2 Motivated by fundamental and practical considerations, investigations have been carried out to determine current-induced mass transport enhancement in solid-solid and solid-liquid interactions. [3][4][5][6][7] The primary practical relevance of electromigration relates to the design of integrated circuits. 8 Component miniaturization with the concomitant increase in current density leads to the electromigration and the formation of failure-inducing defects.…”

New Entropic Routes for Nano‐Bands and Nano‐Particles

“…When coupled with the microstructure features presented in this article, it appears that the main hypothesis of this article could be valid i.e., that the micro-kinetic steps could involve BZ reactions in NiAl synthesis. The intermediates have been identified often as at least N1AI3, and N12AI3 [24,29,32,46,82]. The asymmetric rise and fall of intermediaries which has been reported [24,46,60,61] is also one feature commonly noted in the concentration-time plots of the intermediaries in typical BZ reaction plots [1,31].…”