Kinetic Study of Titanium-Modified Phenolic Resin Curing Process by DSC Analysis

Abstract

A Titanium-modified phenol-formaldehyde resin (Ti-PF) was prepared. FT-IR was adopted to characterize the molecular structure of the modified resin. And the curing behavior and curing kinetic characteristics were studied by differential scanning calorimetry (DSC). The initial curing temperature Ti, the exothermic peak temperature Tp and the end curing temperature Td of Ti-PF are 153.1°C, 172.5°C and 193.9°C, respectively, all about 10°C higher than that of the unmodified phenolic resin. The Kissinger and Crane equations were applied to establish the curing kinetic parameters of Ti-PF. The kinetic analysis indicates the activation energy for the Ti-PF is 79.9kJ•mol-1, lower than that of the unmodified phenolic resin(87.6kJ•mol-1). In addition, the thermal degradation behavior of the cured Ti-PF was studied by thermal gravimetric (TG) method. TG results show that the char yield of Ti-PF is 73.3% at 850°C, while that of the unmodified phenolic resin is only 62.3%. It demonstrated that titanium-modified phenolic resin has much better thermal stability compared with the unmodified one.

Strong, Durable, and Aging-Resistant Bamboo Composites Fabricated by Silver In Situ Impregnation

“…The overall trend is as follows: when the temperature was lower than 100 °C, the viscosity of PF adhesive decreased with an increase of temperature. When the temperature was more than 100 °C, the degree of intermolecular reaction increased and the viscosity increased significantly with the evaporation of water . The viscosity increase rate of the PF adhesive by different treatment parameters at 180 °C can be ranked as 77.22% (Ag treatment), 253.89% (HVEF treatment), and 611.84% (Ag + HVEF treatment).…”

“…When the temperature was more than 100 °C, the degree of intermolecular reaction increased and the viscosity increased significantly with the evaporation of water. 16 The viscosity increase rate of the PF adhesive by different treatment parameters at 180 °C can be ranked as 77.22% (Ag treatment), 253.89% (HVEF treatment), and 611.84% (Ag + HVEF treatment). The reasons are as follows: (1) The particle size of nanosilver particles on the surface of bamboo is only 50 nm, and the specific surface area is large.…”

“…Phenol formaldehyde (PF) adhesive is widely used in making bamboo-based panels, which have high bonding strength and can be used in indoor and outdoor environments. , However, there are free phenol and free formaldehyde in the PF adhesive, which are darker in color and more brittle . Compared with that of the urea formaldehyde adhesive, the curing temperature of PF is higher, resulting in low production efficiency and large energy consumption in the production process of wood-based panels. Meanwhile, the heat resistance and toughness of the PF adhesives are poor .…”

The effect of boron incorporation on the thermo-oxidative stability of phenol-formaldehyde resin and its pyrolyzate phase

“…To improve the high-temperature ablation and charring yield of PF, the incorporation of boron, phosphorus, silicon, titanium or other compounds into the backbone of phenolic resin has been reported by many researchers [1][2][3]. For the excellent performances, such as thermal stability, mechanical strength and dielectric properties, modified phenolic resin (B-PF) obtained by introducing boron into the main chain of a phenolic resin is the earliest studies.…”