(Keynote) In Situ AFM Imaging and Stress Measurements during Interruption of Electrochemical Deposition of Copper Nanofilms

Abstract

In-situ stress measurements and in-situ AFM imaging were employed to study time evolution of stress during interruption of the room-temperature electrodeposition of copper nanofilms. Generally, when deposition was interrupted, tensile stress decreased as predicted by Chason's model for low mobility deposits. At all potentials, upon resuming deposition stress recovered to its pre-interrupted state. The relative reduction in stress during interruption increased with increasing overpotential.