Abstract:Over the last several decades, HASL (hot air solder level) coating has been one of the most robust finishes. During the HASL process, the copper surfaces of bare boards are first cleaned and coated with flux, the boards continue to be dumped into a lead or lead-free solder pot and finally the extra solder is blew out. As the intermetallic has already been formed in the HASL process, the HASL pads are easily soldered well because during the soldering process it is only need to reflow the solder. However, the HA… Show more
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