“…The large work function difference between the top and bottom electrodes is essential for the asymmetric effective barrier seen in the top and bottom electrodes to enable the rectifying feature. So far, the self‐rectifying memory devices with such bilayer device structures have been intensively studied, for example, NiSi/HfO x /TiN, [ 180 ] Ge/HfO x /Ni, [ 181 ] He‐LiNbO 3 /Pt/SiO 2 /LiNbO 3 , [ 182 ] Pt/Ta 2 O 5 /HfO 2− x /TiN, [ 183 ] Ni/HfO 2 /SiO 2 /Si diode, [ 184 ] Pt/TaO x /n‐Si, [ 185 ] Al/MoO x /Pt, [ 186 ] (ITO)/InGaZnO/ITO, [ 187 ] Pt/HfO 2− x /TiN, [ 188 ] Pt/amorphous In−Ga−Zn−O (a‐IGZO)/TaO x /Al 2 O 3 /W, [ 189 ] Ti/SiO x N y /AIN/Pt, [ 190 ] Pd/HfO 2 /WO x /W, [ 191 ] Ag/a‐Si/p + ‐Si, [ 192 ] Au/ZrO 2 :nc‐Au/n + Si, [ 193 ] Au/Li−ZnO/ZnO/Pt, [ 194 ] Ni/SiN/HfO 2 /Si, [ 195 ] Pd/HfO 2 /TaO x /Ta, [ 196 ] Ni/Al 2 O 3 /p‐Al doped GaN (p‐AlGaN), [ 197 ] Si 3 N 4 /SiO 2 /Si, [ 198 ] Pt/Ta 2 O 5 /HfO 2− x /Hf, [ 199 ] Ti/GaO x /NbO x /Pt, [ 200 ] Ti/NiO x /Al 2 O 3 /Pt, [ 201 ] etc. Li et al reported a p‐Si/SiO 2 /n‐Si memristor.…”