2003
DOI: 10.1080/0026897031000068578
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Kapitza resistance at the liquid—solid interface

Abstract: Using equilibrium and nonequilibrium molecular dynamics simulations, we determine the Kapitza resistance (or thermal contact resistance) at a model liquid solid interface. The Kapitza resistance (or the associated Kapitza length) can reach appreciable values when the liquid does not wet the solid. The analogy with the hydrodynamic slip length is discussed.

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Cited by 286 publications
(268 citation statements)
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“…The slip length, which describes the velocity discontinuity between the liquid and the solid, is defined as [10][11][12] …”
mentioning
confidence: 99%
“…The slip length, which describes the velocity discontinuity between the liquid and the solid, is defined as [10][11][12] …”
mentioning
confidence: 99%
“…Here the coefficients η, ζ , and λ denote the shear viscosity, bulk viscosity, and heat conductivity, respectively, β and κ are the interfacial parameters for the velocity slip and temperature slip (with κ directly related to the Kapitza resistance) [44], respectively, λ s is the surface heat conductivity, α is the interfacial parameter controlling the density relaxation [25], and χ is the parameter controlling the mechanical-thermal cross coupling at the interface [22]. Except for χ whose sign is determined by fluid-solid interactions at microscopic length scale [46,55,56], these bulk and interfacial parameters are all positive as required by the positive definiteness of σ and σ surf .…”
Section: Dynamic Van Der Waals Theorymentioning
confidence: 99%
“…Physically, this continuum hydrodynamic model is closely related to the so-called model "H" which was originally devised to describe the critical dynamics of thermal fluctuations [41,42]. Supplemented with the hydrodynamic boundary conditions derived in our previous works [22,25], this model can be used to fully take into account the various physical processes involved in the contact line dynamics, including phase transition (evaporation or condensation) and capillary flow in the bulk fluid region [26,27], boundary slip of fluid [25,39,40,43], temperature slip across the fluid-solid interface [44,45], and mechanical-thermal cross coupling at the fluid-solid interface [46]. Due to the use of diffuse-interface method, the stress and thermal singularities are resolved automatically.…”
Section: Introductionmentioning
confidence: 99%
“…Flows through nanochannels have been shown to produce quadratic temperature profiles which induce a heat flux, even in the absence of a temperature gradient [24,25]. Other studies focused on the thermal resistance at the solid-liquid interface and have correlated it with the vibrational motion of the solid, as well as the liquid properties [26,27]. The thermal conductivity of a fluid has also been related to the channel width and system temperature [28,29].…”
Section: Introductionmentioning
confidence: 99%