Ka band power pHEMT technology for space power flip-chip assembly

Rogeaux, E.; Fraysse, Jean-Philippe; Schaffauser, C.; George, Sébastien; Pons, Dirk J.; Fellon, P.; Geiger, Dorin; Théron, D.; Haese, N.; Verdeyme, Serge; Quéré, Raymond; Baillargeat, Dominique; Ngoya, Edouard; Long, S.; Escotte, L.

doi:10.1109/mwsym.2001.967278

Cited by 5 publications

(3 citation statements)

References 3 publications

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“…Isolation of strip-line couplers can be improved by introducing lumped or distributed capacitors at the edges or in the center of the coupled region. 3,4 In the broadside coupled strip-line couplers, capacitors are connected to the ground in shunt capacitive compensation technique. 5 Recently, Slawomir et al 6 high power rf capacitors are large in size and lossy above 10 MHz frequency.…”

Section: Introductionmentioning

confidence: 99%

Design and development of 3 dB patch compensated tandem hybrid coupler

Yadav

Kumar

Kulkarani

2013

Review of Scientific Instruments

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Design and development procedure of the strip line based 3 dB patch compensated tandem hybrid coupler at 91.2 ± 15 MHz and 2.5 kW is presented. The coupled strip-line structure is designed and electromagnetic analysis software is used for accurate modelling and optimization of parameters. Coupled strip lines are well known for poor impedance matching and poor isolation due to discontinuities, fabrication tolerance constraints, and theoretical approximations in design. These effects are realized and compensated or taken into consideration. The conventional methods of compensation like open stubs or lumped capacitors are useful in the low rf power applications only. In the present paper, patch compensation technique is explored, explained, applied, and incorporated in the development of a 3 dB tandem hybrid coupler. This newly explored patch compensation technique is found substantially effective in improving the overall performance in terms of return loss and isolation. A prototype tandem coupler rated for 2.5 kW at 91.2 ± 15 MHz, has been developed, fabricated, tested, and the effect of patch compensation technique is found to be quite effective.

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Section: Introductionmentioning

confidence: 99%

Design and development of 3 dB patch compensated tandem hybrid coupler

Yadav

Kumar

Kulkarani

2013

Review of Scientific Instruments

View full text Add to dashboard Cite

show abstract

“…Cylindrical bumps, with 30 µm diameter and height, are laid out on the circuit to allow the further flip-chip assembly [2]. Microwave and bias probe pads are also added in the layout in order to be able to measure the amplifier before the flip-chip report.…”

Section: Circuit Designmentioning

confidence: 99%

“…This cost saving can further be improved by using a flip-chip assembly which achieves simultaneously the mechanical and electrical link between the chip and its mounting substrate. Moreover, flip-chip report is automatizable and compact [1] and thermal bumps implemented on the source pads of the transistors reduce the thermal resistance of the devices [2]. However, it makes necessary the use of a coplanar technology in order to decrease the carrier substrate detrimental influence on the circuit behavior [3].…”

Section: Introductionmentioning

confidence: 99%