Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method

Cai, Miao; Liang, Zhilei; Tian, Kunmiao; Yun, Minghui; Zhang, Ping; Yang, Dandan; Zhang, Guoqi

doi:10.1109/access.2019.2936924

Cited by 7 publications

(5 citation statements)

References 41 publications

(55 reference statements)

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“…Combining formula (4) and (5), the relationship between damage factor D and initial charging time 0 T and real-time monitoring charging value T is established, which is defined as Dfun :…”

Section: A Modeling and Fittingmentioning

confidence: 99%

“…Chauhan et al have used temperature rise to assess the degradation in varistor solder interconnects due to thermal fatigue damage [4]. Whereas Cai et al used the junction temperature of LEDs to predict the lifetime of luminaires [5]. Ji et al used the on-state voltage drop as an indicator to monitoring the wire-bond-related failure in the insulated-gate bipolar transistor (IGBT) [6].…”

Section: Introductionmentioning

confidence: 99%

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A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Jing

Huang

et al. 2020

IEEE Access

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Interconnect structure, as the weak point of reliability, is often the critical part in electronic devices during their service. In order to monitor the health state and degradation of interconnect structure, the charging time is used as the health indicator for interconnect structure of QFP package in this paper. Firstly, a monitoring circuit, based on the proposed electrical model of interconnect structure, is designed to measure the charging time in real time. Secondly, the equivalent circuit of the monitoring circuit is derived and the effect of the parameters of the monitoring circuit on the charging time is analyzed. Then, experiments under vibration and steady temperature are conducted to analyze the failure of interconnect structure and derive the damage model. Finally, the effect of charging time as the health indicator to monitor the damage of interconnection structures is analyzed and the uncertainty is discussed. Results show that the charging time is directly related to the interconnect damage and can well characterize the interconnect failure, which can be used as a health indicator to assess the damage and predict the failure of interconnect structure.

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“…Combining formula (4) and (5), the relationship between damage factor D and initial charging time 0 T and real-time monitoring charging value T is established, which is defined as Dfun :…”

Section: A Modeling and Fittingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Jing

Huang

et al. 2020

IEEE Access

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“…The temperature reached at the p–n junction is called junction temperature (T j ) and is considered a key parameter in LED performance [ 19 ]. The junction temperature at which light-emitting diodes have to operate must be low, as there is an inverse relationship between junction temperature and the lifetime of the LED [ 20 ].…”

Section: Introductionmentioning

confidence: 99%

Impact of Thermal Dissipation on the Lighting Performance and Useful Life of LED Luminaires Applied to Urban Lighting: A Case Study

Unión-Sánchez

Hermoso-Orzáez

Hervás-Pulido

et al. 2022

IJERPH

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Currently, LED technology is an established form of lighting in our cities and homes. Its lighting performance, durability, energy efficiency and light, together with the economic savings that its use implies, are displacing other classic forms of lighting. However, some problems associated with the durability of the equipment related to the problems of thermal dissipation and high temperature have begun to be detected, which end up affecting their luminous intensity and the useful life. There are many studies that show a direct relationship between the low quality of LED lighting and the aging of the equipment or its overheating, observing the depreciation of the intensity of the light and the visual chromaticity performance that can affect the health of users by altering circadian rhythms. On the other hand, the shortened useful life of the luminaires due to thermal stress has a direct impact on the LCA (Life Cycle Analysis) and its environmental impact, which indirectly affects human health. The purpose of this article is to compare the results previously obtained, at different contour temperatures, by theoretical thermal simulation of the 3D model of LED street lighting luminaires through the ANSYS Fluent simulation software. Contrasting these results with the practical results obtained with a thermal imaging camera, the study shows how the phenomenon of thermal dissipation plays a fundamental role in the lighting performance of LED technology. The parameter studied in this work is junction temperature (Tj), and how it can be used to predict the luminous properties in the design phase of luminaires in order to increase their useful life.

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“…However, simulationbased evaluations of HE and SE are mostly unexplored field of research. [18]- [25] The compact thermal modelling and simplifying complex circuits into RC ladder network described in [26][27] is a quick method to evaluate thermal characteristics of a device. In this study, we focused on single LED and its packaging, hence, we required a detailed 3D thermal model allowing more precise visualization of thermal conduction throughout the structure.…”

Section: Introductionmentioning

confidence: 99%

“…In this study, we focused on single LED and its packaging, hence, we required a detailed 3D thermal model allowing more precise visualization of thermal conduction throughout the structure. A two-step hybrid method, utilizing thermal simulations and temperature measurements, is found to be reliable to predict the thermal behavior of a LED [24], [25], and is used in our research as well. The concept is used to effectively estimate the temperature distribution and thus, the lifetime of the LED with existing product reliability data.…”

Section: Introductionmentioning

confidence: 99%

Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics

Hannila

Heinilehto

Remes

et al. 2021

IEEE Trans. Instrum. Meas.

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Hybrid structural electronics (HSE) consists of printed electronics, conventional rigid electronics and load bearing supporting parts of a device (plastic, glass etc.). Extra-large area and flexible lighting elements with embedded light emitting diodes (LEDs) are an example of such applications. LEDs can be used e.g. as light sources to create smart surfaces for the architectural or automotive industry. Once the LEDs are embedded into the structure, they cannot be replaced. In order to make sustainable HSE products with long lifetime, the new type of designs is needed. The elements of HSE undergoes conditions with elevated thermal stresses while in operation. That is known to have an impact on their performance and lifetime, thus making a proper heat management of the LED crucial. Due to the novel additive manufacturing methods, structures, and unconventional material combinations, many thermal management related aspects are not known. In this study, a two-step hybrid method, including thermal modelling and measurements, is utilized to estimate thermal behavior of a surface mounted LED on polymer substrate used in HSE. The model is created and simulated in COMSOL Multiphysics. The validity and accuracy of the model's thermal behavior is verified through measurements with thermal transient measurements. Based on the experimental verification, the proposed simulation model only has small (less than 2 %) temperature variations when compared with measurements. Hence, the developed model can be used as a basis for designing structural LED elements and predicting their performance characteristics in different user cases.

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Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method

Abstract: The associate editor coordinating the review of this article and approving it for publication was Lei Jiao. Gr L Grashof number Ra L Rayleigh number T pAverage temperature at the bottom face of the LED package in package model (Characteristic length (m)

Cited by 7 publications

References 41 publications

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Impact of Thermal Dissipation on the Lighting Performance and Useful Life of LED Luminaires Applied to Urban Lighting: A Case Study

Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics

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