Junction temperature estimation for multiple light emitting diodes based on surface point measurement

Abstract

Junction temperature is a critical parameter for light emitting diode (LED) lifetime and performance estimation. However, it is hard to obtain the junction temperatures in multiple LEDs packaging. In this paper, a estimation method for junction temperatures of multiple LEDs packaging was presented. The method based on an analytical model, and temperature of a point at the substrate surface should be measured to achieve the estimation. Comparison simulation was conducted and it was found that the errors between estimation method and simulation were no more than 3%, validating that the present method has enough accuracy.