Junction temperature considerations in evaluating electronic parts for use outside manufacturers-specified temperature ranges

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

“…The origin of the generated heat in electronic circuits is the active device area 38,39 and dense interconnects layers. 40 This is referred to as the chip junction temperature (T J ), which is always higher than the package temperature, related by Equation (4).…”

Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers

“…The part thus uprated may have a modified data sheet for its electrical parameters [4]. Stress balancing is a third uprating approach, but it is only applicable for high temperature uprating [3,6].…”

“…The part thus uprated may have a modified data sheet for its electrical parameters [4]. Stress balancing is a third uprating approach, but it is only applicable for high temperature uprating [3,6].In order to cost-effectively implement an uprating solution for low-temperature application, the performance characteristics of the parts at low temperatures must be understood [7]. In this paper, a silicon bipolar monolithic microwave integrated circuit amplifier is selected as a demonstration vehicle to characterize DC and RF performance at temperatures down to À70°C.…”

Addressing Obsolescence—The Uprating Option

“…There are three methods to uprate parts [3], [12]: parameter conformance, parameter characterization [6], and stress balancing [4]. All three methods need to be validated for a specific application by assembly level testing.…”