2018 18th International Workshop on Junction Technology (IWJT) 2018
DOI: 10.1109/iwjt.2018.8330281
|View full text |Cite
|
Sign up to set email alerts
|

Junction profiling on hot carrier stressed device by dual lens electron holography and scanning capacitance microscopy

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2021
2021
2022
2022

Publication Types

Select...
2

Relationship

1
1

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 0 publications
0
2
0
Order By: Relevance
“…Over the years, several techniques have been developed using electron microscopes for 2D junction profiling. The most notable of these is dual lens electron holography [1][2][3][4][5][6][7], which has flexibility in measuring the variable size of semiconductor devices, making it a versatile technique. Electron holography measures the electrostatic potential of a P-N junction [8,9].…”
Section: Introductionmentioning
confidence: 99%
“…Over the years, several techniques have been developed using electron microscopes for 2D junction profiling. The most notable of these is dual lens electron holography [1][2][3][4][5][6][7], which has flexibility in measuring the variable size of semiconductor devices, making it a versatile technique. Electron holography measures the electrostatic potential of a P-N junction [8,9].…”
Section: Introductionmentioning
confidence: 99%
“…Dual lens electron holography can obtain the highest spatial resolution of 0.6 nm with fringe spacing of 0.2 nm (under the assumption that spatial resolution of an electron hologram is 3× fringe spacing). More industrial applications of the technique have been published [24][25][26].…”
Section: Discussionmentioning
confidence: 99%