Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding

Park, Jae Yong; Lee, Ja Yeon; Park, Hwan Pil; Kim, Sung Chul; Lee, Tae Young; Yoo, Sehoon; Kim, Young‐Ho

doi:10.1016/j.mee.2019.04.030

Cited by 5 publications

(3 citation statements)

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“…The NCA pillar was silica with an average diameter of 800 nm. The role of the silica filler is to lower the coefficient of thermal expansion (CTE) of the NCA, which ensures the reliability of the TCB joints [ 5 ]. During the TCB process, the downward force of the bump squeezed out most of the fillers, but few fillers remained at the solder joint interface.…”

Section: Resultsmentioning

confidence: 99%

“…During the TCB process, the downward force of the bump squeezed out most of the fillers, but few fillers remained at the solder joint interface. Such filler trapping adversely affects the reliability of the pillar bump joints [ 5 , 16 ]. When the filler is trapped at the solder joint interface, the NCA resin is also trapped.…”

Section: Resultsmentioning

confidence: 99%

“…The fine-pitch semiconductor packages have brought about a huge change in the flip-chip bonding process and materials. A thermo-compression bonding (TCB) with non-conductive adhesive (NCA) is increasingly replacing traditional mass flow C4 processes [ 4 , 5 , 6 ]. Substrate pads to which the chip bumps are bonded are also finer, and therefore, the thickness of the surface finish plated on the substrate pad should be thinner than at least half of the pad pitch.…”

Section: Introductionmentioning

confidence: 99%

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Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

et al. 2023

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Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The surface roughness of the EPIG was 82 nm, which was 1.6 times higher than that of the ENEPIG surface finish because the EPIG was so thin that it could not flatten rough bare Cu pads. From the cross-sectional SEM micrographs, the filler trapping of the TC-bonded EPIG was much higher than that of the ENEPIG sample. The high filler trapping of the EPIG sample was due to the high surface roughness of the EPIG surface finish. The contact resistance increased as the thermal cycle time increased. The increase of the contact resistance with 1500 cycles of the thermal cycle test was 26% higher for the EPIG sample than for the ENEPIG sample.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%