2008
DOI: 10.1007/s10853-008-2894-5
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Joining of tungsten carbide to nickel by direct diffusion bonding and using a Cu–Zn alloy

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Cited by 33 publications
(8 citation statements)
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“…2(a). The solubility limit of Zn in the α-Cu (s.s) is further increased by the addition of Ni (Lemus-Ruiz et al 2008), which reduces the Ag-Cu-Zn eutectic temperature and promotes the formation of eutectic phases during the cooling process.…”
Section: Microstructurementioning
confidence: 99%
“…2(a). The solubility limit of Zn in the α-Cu (s.s) is further increased by the addition of Ni (Lemus-Ruiz et al 2008), which reduces the Ag-Cu-Zn eutectic temperature and promotes the formation of eutectic phases during the cooling process.…”
Section: Microstructurementioning
confidence: 99%
“…Various ceramic-to-metal joining techniques, utilizing or not a liquid phase, have been developed and improved over the past 60 years, among which solid-state diffusion bonding [2][3][4][5][6][7] and reactive metal brazing [2,5,[7][8][9][10]. Both processes are widely used, especially because strong and gas proof bonds can be obtained.…”
Section: Introductionmentioning
confidence: 99%
“…This is interesting because the sintering temperature of 550 • C in the SPS is lower than the sintering temperature of 600 • C in the HP process. In general, the diffusion bonding is known to increase the interfacial strength of the reaction layer, due to the chemical reaction between the metal powder and the ceramic powder [19,20]. Therefore, it is expected that the interface strength will be stronger than the foams fabricated by the HP process, due to the diffusion bonding into the GHS shell of the foam fabricated by the SPS process.…”
Section: Resultsmentioning
confidence: 99%