Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors

Abstract

Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature sensors presents particular difficulties, due to their non-standard designs, unique functionality and applications in various environments. One of the main challenges relates to the fact that common methods such as reflow soldering or wave soldering cannot be applied to making joints to the materials used for the sensing layers (oxides, polymers, graphene, metallic layers) or to the thin metallic layers that act as contact pads. This problem applies especially to sensors designed to work at cryogenic temperatures. In this paper, we demonstrate a new method for the dynamic soldering of outer leads in the form of metallic strips made from thin metallic layers on ceramic substrates. These leads can be used as contact pads in sensors working in a wide temperature range. The joints produced using our method show excellent electrical, thermal, and mechanical properties in the temperature range of 15–300 K.

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

“…A grid overlay of 50 × 50 was applied over the sample to measure L i and a i . For a measured value of i (L/a) i ≈ 30 and L = a = 50, the value of r/r 1 ≈ 18 was obtained [114]. Thus, the increased Ohm resistivity of the electroless copper film is due to inhomogeneous deposition as shown in Figure 6.…”

“…M. Radoeva and B. Radoev [114] analysed the factors that determine the ohmic resistivity of electroless deposited copper layers. An integral method was used for thickness measurement due to uncoated substrate areas making the electroless deposition inhomogeneous.…”

“…Integral resistance of the circuit is the sum, By rewriting Equation (7) in the form of geometrical variables measurable from the picture, A grid overlay of 50 × 50 was applied over the sample to measure L i and a i . For a measured value of and , the value of was obtained [114]. Thus, the increased Ohm resistivity of the electroless copper film is due to inhomogeneous deposition as shown in Figure 6.…”

Atypical Properties of a Thin Silver Layer Deposited on a Composite Textile Substrate

“…Crimping cannot be used for ceramic substrates, because it causes permanent damage to the brittle substrate. We used indium soldering, which ensures joints with very good electrical and mechanical properties [ 34 ]. All samples are presented in Table 1 .…”

Study of mechanical properties of indium-based solder alloys for cryogenic applications

“…In such applications solder plays very important role to bind the circuit board and electronic components in well-connected condition to avoid any failure in their operation and connection. Until recently lead (Sn) was a well-known material for solders and electronic packaging applications (Hwang and Guo, 1994; Alam and Gupta, 2014; Vianco, 2019) used for cryogenic sensors and components (Lebioda et al , 2021). Restriction of certain hazardous substances was implemented by European Commission in 2016 for use of lead in electrical and electronic equipment, as lead is hazardous and toxic for human body as well as for environment (Hutton, 1987).…”