Joining Active Metals with Al₂O₃ by Use of Solders

Abstract

The work deals with joining active metals as Ti, Zr and Hf with Al2O3ceramics. The solubility of these active metals in selected Sn and In based solders was studied at a selected soldering temperature. Capability of active metals to wet Al2O3ceramics and to form a diffusion bind was ascertained. Soldering was performed with Sn, Sn5Ag, In and In30Sn solders, which were enriched by an active element from metallic substrate of the joint in soldering process. Soldering temperature in vacuum varied from 770 to 870 °C and soldering time was selected from 8 to 20 min. It was found out that the most suitable metal for active solders is Ti, because it is dissolved in Sn solder already at temperature 780 °C. Wetting of ceramic Al2O3substrate and formation of a diffusion bond was achieved already at temperature 830 °C/8 min. Diffusion bond with Zr was formed just at temperature 870 °C/20 min. and it was impossible to form a diffusion bond with Hf.

Research of Joining Brittle Nonmetallic Materials with an Active Solder

“…Thus to ensure the wettability of nonmetallic material and lower the wetting angle, soldering must be done using solder alloyed with an active element [18][19][20][21][22]. Titanium and zirconium are mostly used as the active element [23]. The paper [24] was devoted to the wettability of Si-Al-O-N ceramics with Sn based solders and the addition of different active elements.…”