2018
DOI: 10.1016/j.jmatprotec.2018.02.035
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Jet electrochemical machining of micro dimples with conductive mask

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Cited by 34 publications
(17 citation statements)
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“…The mask used had through holes of 200 μm diameter on stainlesssteel samples. The machining localisation was improved with the use of a conductive mask over an insulated mask, at the cost of a reduction in current efficiency [18]. Comparatively, this study produced dimples 240 μm wide by 85 μm deep, no better than those achieved by Hackert-Oschätzchen et al [19] without the use of a mask.…”
Section: Increase In Current Improves Surface Roughness Valuesmentioning
confidence: 66%
See 1 more Smart Citation
“…The mask used had through holes of 200 μm diameter on stainlesssteel samples. The machining localisation was improved with the use of a conductive mask over an insulated mask, at the cost of a reduction in current efficiency [18]. Comparatively, this study produced dimples 240 μm wide by 85 μm deep, no better than those achieved by Hackert-Oschätzchen et al [19] without the use of a mask.…”
Section: Increase In Current Improves Surface Roughness Valuesmentioning
confidence: 66%
“…Chen et al [18] proposed a method of machining micro dimples through the use of a conductive mask. The use of a conductive mask was thought to reduce the intensity of the electric field around the edge of the dimple.…”
Section: Increase In Current Improves Surface Roughness Valuesmentioning
confidence: 99%
“…The auxiliary anode was proposed to reduce the marginal effect of the electric field on the workpiece, thereby improving the machining accuracy of the microstructure [27]. Chen et al [28] developed a method of JEM with a conductive mask to generate micro-dimples, which evidently reduced the overcut and enhanced the machining localization.…”
Section: Instructionmentioning
confidence: 99%
“…The machining depth of generated micropatterns is very less. The conductive mask jet electrochemical machining method is employed to reduce the undercut of the array of micro impressions and improve the machining localization [11]. But, this method is prolonged and expensive due to fabrication of one by one circular impression in the micro dimple array.…”
Section: Introductionmentioning
confidence: 99%