Issues in fatigue life prediction model for underfilled flip chip bump

Islam, Nokibul; Syed, Ahmer; Hwang, TaeKyeong; Ka, YunHyeon; Kang, WonJoon

doi:10.1109/ectc.2011.5898599

Cited by 7 publications

(4 citation statements)

References 13 publications

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“…The test data described earlier was simulated using the simulation technique described elsewhere [4]. The modeling approach non-linear creep behavior for Sn2.3Ag solder bumps using sinh equation described by Eq (3).…”

Section: Simulation Matrix and Resultsmentioning

confidence: 99%

“…Previous attempt [4] to use life prediction model developed for SAC405 2 nd level solder joint resulted in predictions for flip chip bumps which were an order of magnitude lower than the actual mean life from tests. Bump fatigue life prediction using finite element analysis (FEA) is complicated by the presence of underfill due to: 1) Deformation behavior of underfill materials during temperature cycling, and 2) modeling of solder-underfill interface.…”

Section: Introductionmentioning

confidence: 91%

“…In addition, bare die packages without underfill (Leg 6) were also tested using the temperature profiles shown in Figure 2. [4,5]. Table 2 provides the summary of results for all combinations after almost 100% failure rate was achieved in most of the test legs.…”

Section: Test Datamentioning

confidence: 97%

“…The details of this test program and data have been provided elsewhere [4,5], but a brief summary is provided here for the sake of completeness. Table 1 provides the details of the test matrix which includes three package type, two substrate materials, three underfills (capillary and molded), and two test conditions.…”

Section: Test Datamentioning

confidence: 99%

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Factors affecting Pb-free flip chip bump reliability modeling for life prediction

Syed

Sharon

Darveaux

2012

2012 IEEE 62nd Electronic Components and Technology Conference

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The reliability of flip chip bumps remains a concern even after underfilling the gap between the chip and package substrate. A number of factors influence this reliability and it is desirable to evaluate the effect of these factors through simulations. However, underfilling introduces new material and modeling variables into the simulation methodology which need to be considered carefully.This paper reports on the study conducted to evaluate the impact of underfill material properties and modeling methodologies on solder bump response. Further, different post-processing schemes and damage indicators are evaluated to determine the best indicators for fatigue damage in solder bumps for flip chip applications. The results of these evaluations are compared with fatigue data collected on multiple package types using temperature cycle tests with insitu resistance monitoring.

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Section: Simulation Matrix and Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 91%

Section: Test Datamentioning

confidence: 97%

Section: Test Datamentioning

confidence: 99%

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