Ionic Conductors: Effect of Temperature on Conductivity and Mechanical Properties and Their Interrelations

Abstract

The ionic transport and the mechanical properties in solids are intimately related. However, few studies have been done to elucidate the background of that relation. With the objective to fill this gap and gain further understanding on the fundamental properties of ion conducting materials, we are studying systematically the mechanical properties of different materials. In the present study, after showing briefly our previous results obtained in crystalline materials, results regarding the relation between ionic conduction and mechanical properties in superionic glasses is presented. All these results indicate the intimate relation between the mechanical and ionic conduction. The results also indicate that the Grüneisen parameter and the Anderson–Grüneisen parameter of ionic conductors exhibit large temperature dependence and increase with temperature.

The latest research progress of conductive hydrogels in the field of electrophysiological signal acquisition

“…Balancing the relationship between the mechanical properties and electrical conductivity of ion-conducting hydrogels is also an issue to focus on, 133 and a common approach is to optimize the hydrogel network structure. Shu et al 131 designed and prepared double crosslinked cellulose hydrogels by dissolving cellulose in ZnCl 2 /CaCl 2 solution and chemically cross-linking it using epichlorohydrin (ECH) (Fig.…”

Copper ion beam emission in solid electrolyte Rb4Cu16I6.5Cl13.5

“…The ionic conductivity of Rb 4 Cu 16 I 7 Cl 13 is reported to reach the highest value at room temperature, among all known solid state electrolytes. [26,27] In space technological area, copper-based solid electrolytes may be used in the form of ion emitter arrays for the field emission electric propulsion, owing to the low operating temperature, long lifetime, small energy spread and small size of the ion source. In this work, Rb 4 Cu 16 I 6.5 Cl 13.5 solid electrolyte powders were prepared by ball milling and followed by deposition of Rb 4 Cu 16 I 6.5 Cl 13.5 film by thermal evaporation dipping method to cover a tip emitter.…”